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參數(shù)資料
| 型號： | MAX9259GCB/V+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/51頁 |
| 文件大小： | 0K |
| 描述： | IC SERIALIZER GMSL 64TQFP |
| 標準包裝： | 160 |
| 系列： | * |
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Gigabit Multimedia Serial Link with Spread
Spectrum and Full-Duplex Control Channel
MAX9259/MAX9260
2 ______________________________________________________________________________________
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND
MAX9259...........................................................-0.5V to +1.9V
MAX9260...........................................................-0.5V to +3.9V
DVDD to GND (MAX9259) ...................................-0.5V to +1.9V
DVDD to DGND (MAX9260).................................-0.5V to +3.9V
IOVDD to GND (MAX9259) ..................................-0.5V to +3.9V
IOVDD to IOGND (MAX9260) ..............................-0.5V to +3.9V
Any Ground to Any Ground .................................-0.5V to +0.5V
OUT+, OUT- to AGND (MAX9259) ......................-0.5V to +1.9V
IN+, IN- to AGND (MAX9260) ..............................-0.5V to +1.9V
LMN_ to GND (MAX9259)
(60kI source impedance)................................-0.5V to +3.9V
All Other Pins to GND (MAX9259) ....... -0.5V to (IOVDD + 0.5V)
All Other Pins to IOGND (MAX9260) ... -0.5V to (IOVDD + 0.5V)
OUT+, OUT- Short Circuit to Ground or
Supply (MAX9259).................................................Continuous
IN+, IN- Short Circuit to Ground or
Supply (MAX9260).................................................Continuous
Continuous Power Dissipation (TA = +70NC)
64-Pin TQFP (derate 31.3mW/NC above +70NC) .......2508mW
56-Pin TQFN (derate 47.6mW/NC above +70NC)....3809.5mW
ESD Protection
Human Body Model (RD = 1.5kI, CS = 100pF)
(OUT+, OUT-) to AGND (MAX9259) ............................Q8kV
(IN+, IN-) to AGND (MAX9260) ....................................Q8kV
All Other Pins to Any Ground (MAX9259) ....................Q4kV
All Other Pins to Any Ground (MAX9260) ....................Q4kV
IEC 61000-4-2 (RD = 330I, CS = 150pF)
Contact Discharge
(OUT+, OUT-) to AGND (MAX9259) ..........................Q10kV
(IN+, IN-) to AGND (MAX9260) ....................................Q8kV
Air Discharge
(OUT+, OUT-) to AGND (MAX9259) ..........................Q12kV
(IN+, IN-) to AGND (MAX9260) ..................................Q10kV
ISO 10605 (RD = 2kI, CS = 330pF)
Contact Discharge
(OUT+, OUT-) to AGND (MAX9259) ..........................Q10kV
(IN+, IN-) to AGND (MAX9260) ....................................Q8kV
Air Discharge
(OUT+, OUT-) to AGND (MAX9259) ..........................Q25kV
(IN+, IN-) to AGND (MAX9260) ..................................Q20kV
Operating Temperature Range........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
MAX9259 DC ELECTRICAL CHARACTERISTICS
(VDVDD = VAVDD = 1.7V to 1.9V, VIOVDD = 1.7V to 3.6V, RL = 100I Q1% (differential), TA = -40NC to +105NC, unless otherwise noted.
Typical values are at VDVDD = VAVDD = VIOVDD = 1.8V, TA = +25NC.)
ABSOLUTE MAXIMUM RATINGS
64 TQFP
Junction-to-Ambient Thermal Resistance (BJA) .......31.9NC/W
Junction-to-Case Thermal Resistance (BJC) .................1NC/W
56 TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........21NC/W
Junction-to-Case Thermal Resistance (BJC) .................1NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (DIN_, PCLKIN, PWDN, SSEN, BWS, ES, DRS, MS, CDS, AUTOS, SD, SCK, WS)
High-Level Input Voltage
VIH1
0.65 x
VIOVDD
V
Low-Level Input Voltage
VIL1
0.35 x
VIOVDD
V
Input Current
IIN1
VIN = 0 to VIOVDD
-10
+10
F
A
Input Clamp Voltage
VCL
ICL = -18mA
-1.5
V
SINGLE-ENDED OUTPUT (INT)
High-Level Output Voltage
VOH1
IOH = -2mA
VIOVDD
- 0.2
V
Low-Level Output Voltage
VOL1
IOL = 2mA
0.2
V
Output Short-Circuit Current
IOS
VO = 0V
VIOVDD = 3.0V to 3.6V
16
35
64
mA
VIOVDD = 1.7V to 1.9V
3
12
21
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