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MAX9248/MAX9250
27-Bit, 2.5MHz to 42MHz
DC-Balanced LVDS Deserializers
2
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ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC_ = +3.0V to +3.6V, PWRDWN = high, differential input voltage
VID = 0.05V to 1.2V, input common-mode voltage VCM = VID / 2
to VCC -
VID / 2, TA = -40°C to +105°C, unless otherwise noted. Typical values are at VCC_ = +3.3V, VID = 0.2V, VCM = 1.2V,
TA = +25°C.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC_ to _GND........................................................-0.5V to +4.0V
Any Ground to Any Ground...................................-0.5V to +0.5V
IN+, IN- to LVDSGND............................................-0.5V to +4.0V
IN+, IN- Short Circuit to LVDSGND or VCCLVDS ........Continuous
(R/F, OUTEN, RNG_, REFCLK, SS
PWRDWN) to GND................................. -0.5V to (VCC + 0.5V)
(RGB_OUT[17:0], CNTL_OUT[8:0], DE_OUT, PCLK_OUT,
LOCK) to VCCOGND .............................-0.5V to (VCCO + 0.5V)
Continuous Power Dissipation (TA = +70°C)
48-Lead LQFP (derate 21.7mW/°C above +70°C).....1739mW
ESD Protection
Machine Model (RD = 0
Ω, CS = 200pF)
All Pins to GND............................................................
±200V
Human Body Model (RD = 1.5k
Ω, CS = 100pF)
All Pins to GND..............................................................
±2kV
ISO 10605 (RD = 2k
Ω, CS = 330pF)
Contact Discharge (IN+, IN-) to GND ............................
±10kV
Air-Gap Discharge (IN+, IN-) to GND ............................
±30kV
IEC 61000-4-2 (RD = 330
Ω, CS = 150pF)
Contact Discharge (IN+, IN-) to GND ............................
±10kV
Air-Gap Discharge (IN+, IN-) to GND ............................
±15kV
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SINGLE-ENDED INPUTS (R/F, OUTEN, RNG0, RNG1, REFCLK, PWRDWN, SS)
High-Level Input Voltage
VIH
2.0
VCC + 0.3
V
Low-Level Input Voltage
VIL
-0.3
+0.8
V
VIN = -0.3V to 0 (MAX9248/
MAX9250ECM),
VIN = -0.15V to 0 (MAX9248/
MAX9250GCM),
-100
+20
Input Current
IIN
PWRDWN =
high or low
VIN = 0 to (VCC + 0.3V)
-20
+20
A
Input Clamp Voltage
VCL
ICL = -18mA
-1.5
V
SINGLE-ENDED OUTPUTS (RGB_OUT[17:0], CNTL_OUT[8:0], DE_OUT, PCLK_OUT, LOCK)
IOH = -100A
VCCO - 0.1
IOH = -2mA, RNG1 = high
VCCO - 0.35
High-Level Output Voltage
VOH
IOH = -2mA, RNG1 = low
VCCO - 0.4
V
IOL = 100A
0.1
IOL = 2mA, RNG1 = high
0.3
Low-Level Output Voltage
VOL
IOL = 2mA, RNG1 = low
0.35
V
High-Impedance Output Current
IOZ
PWRDWN = low or OUTEN = low,
VO = -0.3V to (VCCO + 0.3V)
-10
+10
A
RNG1 = high, VO = 0
-10
-50
Output Short-Circuit Current
IOS
RNG1 = low, VO = 0
-7
-40
mA