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參數(shù)資料
| 型號： | MAX803_07 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 復(fù)位半導(dǎo)體 |
| 英文描述： | Very Low Supply Current 3−Pin Microprocessor Reset Monitor |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 94K |
| 代理商： | MAX803_07 |
MAX803 Series, NCP803 Series
http://onsemi.com
8
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AN
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 31801 THRU 07 AND 09 OBSOLETE, NEW
STANDARD 31808.
VIEW C
L
0.25
L1
e
E
E
b
A
SEE VIEW C
DIM
A
A1
b
c
D
E
e
L
L1
H
E
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
MILLIMETERS
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
MAX
H
2.10
2.40
2.64
0.083
0.094
0.104
c
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