7-Channel Precision Temperature Monitor
with Beta Compensation
2  _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, SMBCLK, SMBDATA, ALERT, OVERT,
STBY to GND ....................................................-0.3V to +6.0V
DXP_ to GND..............................................-0.3V to (V
CC
+ 0.3V)
DXN_ to GND ........................................................-0.3V to +0.8V
SMBDATA, ALERT, OVERT Current....................-1mA to +50mA
DXN_ Current......................................................................?mA
Continuous Power Dissipation (T
A
= +70癈)
20-Pin TSSOP
(derate 13.6mW/癈 above +70癈).............................1084mW
Junction-to-Case Thermal Resistance (?/DIV>
JC
) (Note 1)
20-Pin TSSOP...............................................................20癈/W
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) (Note 1)
20-Pin TSSOP............................................................73.8癈/W
ESD Protection (all pins, Human Body Model) ....................?kV
Operating Temperature Range .........................-40癈 to +125癈
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Lead Temperature (soldering, 10s).................................+300癈
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, V
STBY
= V
CC
, T
A
= -40癈 to +125癈, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
=
+25癈.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.0
3.6
V
Software Standby Supply Current
I
SS
SMBus static
3
10
礎(chǔ)
Operating Current
I
CC
During conversion (Note 3)
500
2000
礎(chǔ)
Channel 1 only
11
Temperature Resolution
Other diode channels
8
Bits
T
A
= T
RJ
= +60癈 to +100癈
-1.5
+1.5
3 ?Temperature Accuracy
(Remote Channel 1)
V
CC
= 3.3V,
?= 0.5
T
A
= T
RJ
= 0癈 to +125癈
-2.375
+2.375
癈
T
A
= T
RJ
= +60癈 to +100癈
-2
+2
3 ?Temperature Accuracy
(Remote Channels 26)
V
CC
= 3.3V
T
A
= T
RJ
= 0癈 to +125癈
-2.5
+2.5
癈
T
A
= +60癈 to +100癈
-2
+2
3 ?Temperature Accuracy
(Local)
V
CC
= 3.3V
T
A
= 0癈 to +125癈
-2.5
+2.5
癈
T
A
= T
RJ
= +60癈 to +100癈
-3
+3
6 ?Temperature Accuracy
(Remote Channel 1)
V
CC
= 3.3V,
?= 0.5
T
A
= T
RJ
= 0癈 to +125癈
-4
+4
癈
T
A
= T
RJ
= +60癈 to +100癈
-3
+3
6 ?Temperature Accuracy
(Remote Channels 26)
V
CC
= 3.3V
T
A
= T
RJ
= 0癈 to +125癈
-3.5
+3.5
癈
T
A
= +60癈 to +100癈
-2.5
+2.5
6 ?Temperature Accuracy
(Local)
V
CC
= 3.3V
T
A
= 0癈 to +125癈
-3
+3
癈
Supply Sensitivity of Temperature
Accuracy
?.2
o
C/V
Remote Channel 1 Conversion
Time
t
CONV1
190
250
312
ms
Remote Channels 26
Conversion Time
t
CONV_
95
125
156
ms
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a for-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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