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參數(shù)資料
| 型號(hào)： | MAX6625 |
| 廠商： | Maxim Integrated Products, Inc. |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | 9-Bit Temperature Sensors with IIC-Compatible Serial Interface in a SOT23(帶IIC兼容串口的9位溫度傳感器) |
| 中文描述： | 9位/12位溫度傳感器，帶有I²C兼容串行接口，SOT23封裝 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 1455K |
| 代理商： | MAX6625 |
M
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
S
to GND ................................................................-0.3V to +6V
OT, SCL, SDA to GND.............................................-0.3V to +6V
ADD to GND .................................................-0.3V to (V
S
+ 0.3V)
Current into Any Pin............................................................±5mA
OT Sink Current.................................................................. 20mA
Continuous Power Dissipation
6-Pin SOT23 (derate 9.1mW/
°
C above +70
°
C)............727mW
ELECTRICAL CHARACTERISTICS
(+3V
≤
V
S
≤
+5.5V, T
A =
-55
°
C to +125
°
C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Junction Temperature......................................................+150
°
C
Storage Temperature Range.............................-60
°
C to +150
°
C
Lead Temperature.............................................................Note 1
ESD Rating (Human Body Model)......................................2000V
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
V
S
CONDITIONS
MIN
3
TYP
MAX
5.5
1
UNITS
V
mA
μA
μA
Power-Supply Voltage
I
2
C-compatible active
I
2
C-compatible inactive
Shutdown mode
MAX6625
MAX6626
MAX6625
MAX6626
T
A
= +25
°
C, V
S
= +3V to +3.6V
0
°
C = T
A
≤
+50
°
C, V
S
= +3.0V to +3.6V
0
°
C = T
A
≤
+70
°
C, V
S
= +3.0V to +3.6V
250
1
9
12
0.5
0.0625
Quiescent Current
I
C
ADC Resolution
Bits
Temperature Resolution
°
C/LSB
±
1
±
1.5
±
2.0
Accuracy (Notes 2, 3)
°
C
Power-Supply Sensitivity
(Notes 2, 3)
V
S
= +3V to +5.5V
1
°
C/V
Conversion Time
OT Pullup Resistor
OT Saturation Voltage (Note 4)
OT Delay
T
HIGH
Default Temperature
T
LOW
Default Temperature
I
2
C-COMPATIBLE I/O: SCL, SDA, ADD
t
C
R
P
V
L
133
ms
k
V
ms
°
C
°
C
MAX6625R, MAX6626R only
I
OUT
= 4mA
(Programmable through fault queue)
25
50
0.8
6
×
t
C
1
×
t
C
T
HIGH
T
LOW
80
75
V
S
< +3.6V
V
S
> +3.6V
2
3
Input High Voltage
V
IH
V
Input Low Voltage
Input Hysteresis
V
IL
0.8
V
V
0.2
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