參數(shù)資料
型號(hào): MAX5876EGK+TD
廠商: Maxim Integrated Products
文件頁數(shù): 8/19頁
文件大?。?/td> 0K
描述: IC DAC 12BIT DUAL 250MSPS 68-QFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
設(shè)置時(shí)間: 14ns
位數(shù): 12
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 模擬和數(shù)字
功率耗散(最大): 331mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 68-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 68-QFN 裸露焊盤(10x10)
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 4 電流,單極
采樣率(每秒): 250M
MAX5876
12-Bit, 250Msps, High-Dynamic-Performance,
Dual DAC with LVDS Inputs
16
______________________________________________________________________________________
tantalum or electrolytic capacitors. Ferrite beads with
additional decoupling capacitors forming a pi-network
could also improve performance.
The analog and digital power-supply inputs AVDD3.3,
AVCLK, and DVDD3.3 allow a +3.135V to +3.465V sup-
ply voltage range. The analog and digital power-supply
inputs AVDD1.8 and DVDD1.8 allow a +1.71V to +1.89V
supply voltage range.
The MAX5876 is packaged in a 68-pin QFN-EP pack-
age, providing greater design flexibility, and optimized
DAC AC performance. The EP enables the use of nec-
essary grounding techniques to ensure highest perfor-
mance operation. Thermal efficiency is not the key
factor, since the MAX5876 features low-power opera-
tion. The exposed pad ensures a minimum inductance
ground connection between the DAC and the PCB’s
ground layer.
The data converter die attaches to an EP lead frame with
the back of this frame exposed at the package bottom
surface, facing the PCB side of the package. This allows
for a solid attachment of the package to the PCB with
standard infrared reflow (IR) soldering techniques. A spe-
cially created land pattern on the PCB, matching the size
of the EP (6mm x 6mm), ensures the proper attachment
and grounding of the DAC (refer to the MAX5878 EV kit).
Designing vias into the land area and implementing large
ground planes in the PCB design allow for the highest
performance operation of the DAC. Use an array of at
least 4 x 4 vias (
≤ 0.3mm diameter per via hole and
1.2mm pitch between via holes) for this 68-pin QFN-EP
package. Connect the MAX5876 exposed paddle to
GND. Vias connect the land pattern to internal or external
copper planes to spread heat. Use as many vias as pos-
sible to the ground plane to minimize inductance.
Static Performance Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from either a best straight-line fit
(closest approximation to the actual transfer curve) or a
line drawn between the end points of the transfer func-
tion, once offset and gain errors have been nullified.
For a DAC, the deviations are measured at every indi-
vidual step.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step height and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees a
monotonic transfer function.
Offset Error
The offset error is the difference between the ideal and
the actual offset current. For a DAC, the offset point is
the average value at the output for the two midscale
digital input codes with respect to the full scale of the
DAC. This error affects all codes by the same amount.
Gain Error
A gain error is the difference between the ideal and the
actual full-scale output voltage on the transfer curve,
after nullifying the offset error. This error alters the slope
of the transfer function and corresponds to the same
percentage error in each step.
MAX5876
12
OUTIP/OUTQP
OUTIN/OUTQN
DATA11–DATA0
GND
25
50
25
OUTP
OUTN
Figure 8. Differential Output Configuration
MAX5876
12
OUTIP/OUTQP
OUTIN/OUTQN
DATA11–DATA0
0.1
F
AVDD1.8
DVDD1.8
0.1
F
0.1
F
0.1
F
AVDD3.3
DVDD3.3
0.1
F
AVCLK
BYPASSING—DAC LEVEL
*BYPASS EACH POWER-SUPPLY PIN INDIVIDUALLY.
Figure 9. Recommended Power-Supply Decoupling and
Bypassing Circuitry
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MAX5876EVKIT+ 制造商:Maxim Integrated Products 功能描述:EVKIT FOR MAX8576, 3V TO 28V INPUT, LOW-COST, HYSTERETIC SY - Boxed Product (Development Kits) 制造商:Maxim Integrated Products 功能描述:KIT EVALUATION FOR MAX5876 制造商:Maxim Integrated Products 功能描述:MAX5876 Eval Kit
MAX5877EGK+D 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-Bit 2Ch 250Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
MAX5877EGK+TD 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-Bit 2Ch 250Msps DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube
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