參數(shù)資料
型號(hào): MAX5732AUTN+T
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 18/28頁(yè)
文件大?。?/td> 0K
描述: IC DAC 16BIT 32CHAN SER 56-TQFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
設(shè)置時(shí)間: 20µs
位數(shù): 16
數(shù)據(jù)接口: MICROWIRE?,QSPI?,串行,SPI?
轉(zhuǎn)換器數(shù)目: 32
電壓電源: 模擬和數(shù)字
功率耗散(最大): 2.5W
工作溫度: 0°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 56-WFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 56-TQFN-EP(8x8)
包裝: 帶卷 (TR)
輸出數(shù)目和類型: 32 電壓,單極
采樣率(每秒): *
MAX5732–MAX5735
32-Channel, 16-Bit, Voltage-Output
DACs with Serial Interface
______________________________________________________________________________________
25
protection on their reference inputs to satisfy absolute
maximum ratings. The MAX5734 features outputs that
are almost rail-to-rail. This allows the AVCC and VSS
supplies to be set to voltages within the absolute maxi-
mum ratings of the PEIC. This guarantees that the PEIC
is protected in all situations.
Additional protection is provided by the MAX5734
glitch-free power-up into the clear state with all DAC
outputs set to approximately 0V. Either the serial port or
the
CLR input can assert the clear function.
Power Supplies, Bypassing,
Decoupling, and Layout
Grounding and power-supply decoupling strongly influ-
ence device performance. Digital signals can couple
through the reference input, power supplies, and ground
connection. Proper grounding and layout can reduce
digital feedthrough and crosstalk. Bypass all power sup-
plies with an additional 0.1F and 1F on each pin, as
close to the device as possible. Refer to the MAX5732–
MAX5735 evaluation kit for a suggested layout.
The MAX5732–MAX5735 have four separate power
supplies. AVDD powers the internal analog circuitry
(except for the output buffers) and DVDD powers the
digital section of the device. AVCC and VSS power the
output buffers.
The MAX5732–MAX5735 feature an exposed paddle on
the backside of the package for improved power dissi-
pation. The exposed paddle is electrically connected to
VSS, and should be soldered to a large copper plane
that shares the same potential. For more information on
the exposed paddle QFN package, refer to the following
website: http://pdfserv.maxim-ic.com/arpdf/AppNotes/
4hfan081.pdf
58
59
60
61
62
54
55
56
57
63
38
39
40
41
42
43
44
45
46
47
VSS
DSP
OUT10
TQFP
TOP VIEW
OUT11
OUT12
OUT13
OUT14
OUT15
AV
DD
REFGND
AV
CC
OUT16
52
53
49
50
51
OUT17
OUT18
OUT19
OUT20
N.C.
DOUT
CS
DIN
SCLK
DGND
DV
DD
CLR
LDAC
REFGND
GS
AV
DD
REF
V
SS
OUT21
OUT22
VSS
AGND
OUT23
OUT24
OUT25
OUT26
OUT27
OUT28
33
34
35
36
37
OUT29
OUT30
OUT31
N.C.
OUT3
AGND
OUT4
OUT5
OUT6
N.C.
OUT0
OUT1
OUT2
N.C.
OUT7
OUT8
OUT9
48
AVCC
64
N.C.
23
22
21
20
19
27
26
25
24
18
29
28
32
31
30
17
11
10
9
8
7
6
5
4
3
2
16
15
14
13
12
1
MAX5732–MAX5735
Pin Configurations (continued)
Chip Information
TRANSISTOR COUNT: 152,000
PROCESS: BiCMOS
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