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參數(shù)資料
| 型號： | MAX5479ETE#TG16 |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 9/16頁 |
| 文件大小： | 0K |
| 描述： | IC POT DGTL DUAL 256-TAP 16-TQFN |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 接片： | 256 |
| 電阻（歐姆）： | 100k |
| 電路數(shù)： | 2 |
| 溫度系數(shù)： | 標準值 70 ppm/°C |
| 存儲器類型： | 非易失 |
| 接口： | I²C（設備位址） |
| 電源電壓： | 2.7 V ~ 5.25 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-WFQFN 裸露焊盤 |
| 供應商設備封裝： | 16-TQFN（3x3） |
| 包裝： | 帶卷 (TR) |
MAX5477/MAX5478/MAX5479
Dual, 256-Tap, Nonvolatile, I2C-Interface,
Digital Potentiometers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.25V, H_ = VDD, L_ = GND, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VDD = +5V,
TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
SDA, SCL, VDD to GND .........................................-0.3V to +6.0V
All Other Pins to GND.................................-0.3V to (VDD + 0.3V)
Maximum Continuous Current into H_, L_, and W_
MAX5477......................................................................
±5.0mA
MAX5478......................................................................
±1.3mA
MAX5479......................................................................
±0.6mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TQFN (derate 17.5mW/°C above +70°C) .......1398mW
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
θJA) ........57.2°C/W
Junction-to-Case Thermal Resistance (
θJC) ................40°C/W
TSSOP
Junction-to-Ambient Thermal Resistance (
θJA) ......100.4°C/W
Junction-to-Case Thermal Resistance (
θJC) ................30°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC PERFORMANCE (VOLTAGE-DIVIDER MODE)
Resolution
256
Taps
Integral Nonlinearity
INL
(Note 3)
±1
LSB
Differential Nonlinearity
DNL
(Note 3)
±0.5
LSB
Dual Code Matching
R0 and R1 set to same code (all codes)
±1
LSB
End-to-End Resistance
Temperature Coefficient
TCR
70
ppm/°C
Ratiometric Resistance
Temperature Coefficient
10
ppm/°C
MAX5477
-4
MAX5478
-0.6
Full-Scale Error
MAX5479
-0.3
LSB
MAX5477
4
MAX5478
0.6
Zero-Scale Error
MAX5479
0.3
LSB
DC PERFORMANCE (VARIABLE-RESISTOR MODE)
VDD = 3V
±3
Integral Nonlinearity (Note 4)
INL
VDD = 5V
±1.5
LSB
MAX5477
±1
MAX5478
±1
Differential Nonlinearity (Note 4)
DNL
MAX5479
±1
LSB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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