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參數(shù)資料
| 型號： | MAX5306 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | PLASTIC ENCAPSULATED DEVICES |
| 中文描述： | 低功耗、低干擾、八通道、12位、電壓輸出DAC，串行接口 |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 99K |
| 代理商： | MAX5306 |
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135
°
C biased (static) life test are shown in
Table 1
. Using these results, the Failure
Rate (
λ
) is calculated as follows:
λ
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 79 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 13.75 x 10
-9
λ
= 13.75 F.I.T. (60% confidence level @ 25
°
C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5814) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (
RR-1M
).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85
°
C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The DB06
die type has been found to have all pins able to withstand a transient pulse of
±
1500V per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±
250mA.
Jim Pedicord (Manager, Rel Operations)
Bryan Preeshl (Executive Director
)
Kenneth Huening (Vice President)
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| MAX5306EUE | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5306EUE+ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 8Ch Precision DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5306EUE+T | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 12-Bit 8Ch Precision DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5306EUE-T | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| MAX5307EUE | 功能描述:數(shù)模轉(zhuǎn)換器- DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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