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參數(shù)資料
| 型號： | MAX4984EEVB+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 5/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC USB SWITCH DPDT 10UTQFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | USB 開關(guān) |
| 電路： | 1 x DPDT |
| 導(dǎo)通狀態(tài)電阻： | 10 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2.8 V ~ 5.5 V |
| 電流 - 電源： | 600nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-UFQFN |
| 供應(yīng)商設(shè)備封裝： | 10-UTQFN（1.4x1.8） |
| 包裝： | 帶卷 (TR) |
MAX4983E/MAX4984E
Hi-Speed USB 2.0 Switches
with ±15kV ESD
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.8V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.0V, TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
VCC, COM_, NO_, NC_, EN, EN, CB .................... -0.3V to +6.0V
Continuous Current into Any Terminal............................. ±30mA
Continuous Power Dissipation (TA = +70°C)
10-Pin UTQFN (derate 6.9mW/°C above +70°C)........ 559mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
10-Pin UTQFN ...........................................................20.1°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
10-Pin UTQFN ........................................................ 143.1°C/W
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature Range ......................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering 10s) ..................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Power-Supply RangeVCC
2.8
5.5
V
VCC = 3.0V
0.6
1.5
Supply Current
ICC
VCB = 0V or VCC,
V
EN = 0V or VEN = VCC
VCC = 5.5V
3
6.5
A
Shutdown Supply Current
ISHDN
Switch disabled (V
EN = VCC or VEN = 0V)
0.1
A
Increase in Supply Current
with VCB, VEN Voltage
0
≤ VCB ≤ VIL or VIH ≤ VCB ≤ VCC or 0 ≤ VEN
≤ VIL or VIH ≤ VEN ≤ VCC
2A
Analog Signal Range
VCOM, VNO,
VNC
VEN = VCC or VEN = 0V (Note 3)
0
VCC
V
Fault-Protection Trip Threshold
VFP
COM_ only, TA = +25°C
VCC +
0.6
VCC +
0.8
VCC +
1
V
VCOM = 0V to VCC
510
On-Resistance
RON
VCOM = 3.6V, VCC = 3.0V
5.5
Ω
On-Resistance Match Between
Channels
ΔRON
VCC = 3.0V, VCOM = 2V (Note 4)
0.1
1
Ω
On-Resistance Flatness
RFLAT
VCC = 3.0V, VCOM = 0V to VCC (Note 5)
0.1
Ω
VCC = 4.5V, VCOM = 0V or 4.5V,
VNO, VNC = 4.5V or 0V
-250
+250
nA
Off-Leakage Current
ICOM(OFF)
VCC = 5.5V, VCOM = 0V or 5.5V,
VNO, VNC with 50A sink current to GND
180
A
On-Leakage Current
ICOM(ON)
VCC = 5.5V, VCOM = 0V or 5.5V,
VNO, VNC = unconnected
-250
+250
nA
AC PERFORMANCE
On-Channel -3dB Bandwidth
BW
RL = RS = 50
Ω, signal = 0dBm
950
MHz
f = 10MHz
-48
f = 250MHz
-20
Off-Isolation
VISO
VNO, VNC = 0dBm,
RL = RS = 50
Ω
(Figure 1)
f = 500MHz
-17
dB
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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