參數(shù)資料
型號(hào)： MAX476EUA
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類(lèi)： 運(yùn)動(dòng)控制電子
英文描述： Analog IC
中文描述： OP-AMP, 300 MHz BAND WIDTH, PDSO8
封裝： UMAX-8
文件頁(yè)數(shù)： 2/12頁(yè)
文件大?。?/td> 318K
代理商： MAX476EUA
M
50
Dual SPST Analog Switches in UCSP
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V+...........................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ...........................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle)...±20mA
Continuous Power Dissipation (T
A
= +70
°
C)
8-Pin μMAX (derate 4.5mW/
°
C above +70
°
C).............362mW
9-Bump UCSP (derate 4.7mW/
°
C above +70
°
C).........379mW
ELECTRICAL CHARACTERISTICS
—
Single +3V Supply
(V+ = +3V ±10%, V
IH
= +2.0V, V
IL
= +0.8V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V+ = +3V, T
A
= +25
°
C.)
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Operating Temperature Range ...........................-40
°
C to +85
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Maximum Junction Temperature .....................................+150
°
C
Lead Temperature (soldering, 10s).................................+300
°
C
Bump Temperature (soldering, Note 2)
Infrared (15s) ...............................................................+220
°
C
Vapor Phase (60s) .......................................................+215
°
C
Note 1:
Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
Note 2:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
CONDITIONS
T
A
MIN
TYP
MAX
UNITS
ANALOG SWITCH
Analog Signal Range
V
COM_
,
V
NO_
, V
NC_
0
V+
V
+25
°
C
19
50
On-Resistance
R
ON
V+ = +2.7V,
I
COM_
= 5mA;
V
NO_
or V
NC_
= +1.5V
T
MIN
to
T
MAX
+25
°
C
60
0.8
3.5
On-Resistance Matching
Between Channels (Notes 5, 6)
R
ON
V+ = +2.7V,
I
COM_
= 5mA;
V
NO_
or V
NC_
= +1.5V
T
MIN
to
T
MAX
+25
°
C
4.5
2.3
9
On-Resistance Flatness
(Note 7)
R
FLAT(ON)
V+ = +2.7V,
I
COM_
= 5mA;
V
NO_
or V
NC_
= +1V, +1.5V, +2V
T
MIN
to
T
MAX
+25
°
C
11
-0.1
+0.1
NO_ or NC_ Off-Leakage Current
(Note 8)
I
NO_(OFF)
I
NC_(OFF)
V+ = +3.6V,
V
COM_
= +0.3V, +3V;
V
NO_
or V
NC_
= +3V, +0.3V
T
MIN
to
T
MAX
+25
°
C
-2
+2
nA
-0.1
+0.1
COM_ Off-Leakage Current
(Note 8)
I
COM_(OFF)
V+ = +3.6V,
V
COM_
= +0.3V, +3V;
V
NO_
or V
NC_
= +3V, +0.3V
T
MIN
to
T
MAX
+25
°
C
-2
+2
nA
-0.2
+0.2
COM_ On-Leakage Current
(Note 8)
I
COM_(ON)
V+ = +3.6V,
V
COM_
= +0.3V, +3.0V;
V
NO_
or V
NC_
= +0.3V, +3V, or
floating
T
MIN
to
T
MAX
-4
+4
nA
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