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參數(shù)資料
| 型號： | MAX4750EUD+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 7/14頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL SPDT 14TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 開關(guān) |
| 電路： | 2 x SPDT |
| 導(dǎo)通狀態(tài)電阻： | 50 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2 V ~ 11 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 14-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 14-TSSOP |
| 包裝： | 帶卷 (TR) |
MAX4747–MAX4750
50
, Low-Voltage, Quad SPST/Dual SPDT Analog
Switches in WLP
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS—Single +3V Supply
(V+ = +3V ±10%, VIH = +2.0V, VIL = +0.8V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3V, TA = +25°C.)
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.)
V+ ...........................................................................-0.3V to +12V
IN_, COM_, NO_, NC_ (Note 1)....................-0.3V to (V+ + 0.3V)
Continuous Current (any pin) ...........................................±10mA
Peak Current (any pin, pulsed at 1ms, 10% duty cycle) ...±20mA
Continuous Power Dissipation (TA = +70°C)
14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW
16-Pin Thin QFN (derate 16.9mW/°C above +70°C) .....1349mW
16-Bump WLP (derate 7.3mW/°C above +70°C).........589mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Maximum Junction Temperature .....................................+150°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1: Signals on IN_, NO_, NC_, or COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
PARAMETER
SYMBOL
CONDITIONS
TA
MIN
TYP
MAX
UNITS
ANALOG SWITCH
Analog Signal Range
VCOM_,
VNO_, VNC_
0V+
V
+25°C
17
50
On-Resistance
RON
V+ = +2.7V, ICOM_ = 5mA,
VNO_ or VNC_ = +1.5V
TMIN to
TMAX
60
+25°C
0.2
3.5
On-Resistance Matching
Between Channels
(Notes 5, 6)
RON
V+ = +2.7V, ICOM_ = 5mA,
VNO_ or VNC_ = +1.5V
TMIN to
TMAX
4.5
+25°C
2.7
9
On-Resistance Flatness
(Note 7)
RFLAT(ON)
V+ = +2.7V, ICOM_ = 5mA,
VNO_ or VNC_ = +1V, +1.5V, +2V
TMIN to
TMAX
11
+25°C
-0.1
+0.1
NO_ or NC_ Off-Leakage Current
(Note 8)
INO_(OFF),
INC_(OFF)
V+ = +3.6V,
VCOM_ = +0.3V, +3V,
VNO_ or VNC_ = +3V, +0.3V
TMIN to
TMAX
-2
+2
nA
+25°C
-0.1
+0.1
COM_ Off-Leakage Current
(Note 8)
ICOM_(OFF)
V+ = +3.6V,
VCOM_ = +0.3V, +3V,
VNO_ or VNC_ = +3V, +0.3V
TMIN to
TMAX
-2
+2
nA
+25°C
-0.2
+0.2
COM_ On-Leakage Current
(Note 8)
ICOM_(ON)
V+ = +3.6V,
VCOM_ = +0.3V, +3.0V,
VNO_ or VNC_ = +0.3V, +3V, or
unconnected
TMIN to
TMAX
-4
+4
nA
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