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參數(shù)資料
| 型號： | MAX4685EUB+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH DUAL SPDT 10UMAX |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 功能： | 開關 |
| 電路： | 2 x SPDT |
| 導通狀態(tài)電阻： | 800 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-TFSOP，10-MSOP（0.118"，3.00mm 寬） |
| 供應商設備封裝： | 10-µMAX |
| 包裝： | 帶卷 (TR) |
UCSP Package Consideration
For general UCSP package information and PC layout
considerations, please refer to the Maxim Application
Note (Wafer-Level Ultra-Chip-Board-Scale Package).
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical relia-
bility tests. UCSP reliability is integrally linked to the
user’s assembly methods, circuit board material, and
usage environment. The user should closely review
these areas when considering use of a UCSP package.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Information on Maxim’s qualification plan, test
data, and recommendations are detailed in the UCSP
application note, which can be found on Maxim’s web-
site at www.maxim-ic.com.
Chip Information
PROCESS: BiCMOS
MAX4684/MAX4685
0.5
Ω
Ω/0.8Ω
Ω Low-Voltage, Dual SPDT
Analog Switches in UCSP
_______________________________________________________________________________________
7
tr < 5ns
tf < 5ns
50%
VIL
LOGIC
INPUT
RL
50
Ω
COM_
GND
IN_
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
VOUT = VN_
(
RL
)
RL + RON
VIN_
VIH
tOFF
0
NO_
OR NC
0.9 x V0UT
0.9 x VOUT
tON
VOUT
SWITCH
OUTPUT
LOGIC
INPUT
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES
THAT HAVE THE OPPOSITE LOGIC SENSE.
V+
CL
35pF
V+
VOUT
MAX4684
MAX4685
Figure 2. Switching Time
Test Circuits/Timing Diagrams
50%
VIH
VIL
LOGIC
INPUT
VOUT
0.9 x VOUT
tD
LOGIC
INPUT
RL
50
Ω
GND
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
NO_
IN_
NC_
VOUT
V+
CL
35pF
VN_
COM_
MAX4684
MAX4685
Figure 3. Break-Before-Make Interval
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX4686EBT | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
| MAX4686EBT+ | 功能描述:模擬開關 IC RoHS:否 制造商:Texas Instruments 開關數(shù)量:2 開關配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX4686EBT+T | 功能描述:模擬開關 IC RoHS:否 制造商:Texas Instruments 開關數(shù)量:2 開關配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX4686EBT-T | 功能描述:模擬開關 IC RoHS:否 制造商:Texas Instruments 開關數(shù)量:2 開關配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX4687EBT | 制造商:Maxim Integrated Products 功能描述:- Rail/Tube |
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