參數(shù)資料
型號: MAX4294EUD
廠商: Maxim Integrated Products
文件頁數(shù): 5/18頁
文件大小: 0K
描述: IC OPAMP 1.8VU R/R I/O 14-TSSOP
產(chǎn)品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 96
放大器類型: 通用
電路數(shù): 4
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.2 V/µs
增益帶寬積: 500kHz
電流 - 輸入偏壓: 15nA
電壓 - 輸入偏移: 200µV
電流 - 電源: 100µA
電流 - 輸出 / 通道: 20mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V,±0.9 V ~ 2.75 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 14-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 14-TSSOP
包裝: 管件
MAX4291/MAX4292/MAX4294
Ultra-Small, 1.8V, Power,
Rail-to-Rail I/O Op Amps
______________________________________________________________________________________
13
For a 1V output and a current load of 50mA, the choice
of resistors can be R1 = 2
, R2 = 100k, and R3 =
1M
.
UCSP Information
Layout Issues
Design the layout for the IC to be as compact as possi-
ble to minimize parasitics. The UCSP uses a bump
pitch of 0.5mm (19.7mil) and bump diameter of 0.3
(~12mil). Therefore, lay out the solder-pad spacing on
0.5mm (19.7mil) centers, using a pad size of 0.25mm
(~10mil) and a solder mask opening of 0.33mm (13mil).
Round or square pads are permissible. Connect multi-
ple vias from the ground plane as close to the ground
pins as possible.
Install capacitors as close as possible to the IC supply
voltage pin. Place the ground end of these capacitors
near the IC GND pins to provide a low-impedance
return path for the signal current.
Prototype Chip Installation
Alignment keys on the PC board, around the area
where the chip is located, will be helpful in the proto-
type assembly process. It is better to align the chip on
the board before any other components are placed,
and then place the board on a hot plate or hot surface
until the solder starts melting. Remove the board from
the hot plate without disturbing the position of the chip
and let it cool down to room temperature before pro-
cessing the board further.
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user’s PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
Marking Information
R1
ILOAD
R2
VCC
VEE
R3
VOUT
Q1
MAX4291
Figure 11. Current Monitor for a 2-Cell Battery Stack
AAA
ORIENTATION
PRODUCT ID CODE
LOT CODE
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相關代理商/技術參數(shù)
參數(shù)描述
MAX4294EUD+ 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MAX4294EUD+T 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MAX4294EUD-T 功能描述:運算放大器 - 運放 1.8V uPower Rail-Rail RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MAX4295EEE 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
MAX4295EEE+ 功能描述:音頻放大器 Mono 2W Switch Mode (Class D) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel