參數(shù)資料
型號: MAX4130EUK-T
廠商: Maxim Integrated Products
文件頁數(shù): 8/18頁
文件大小: 0K
描述: IC OPAMP WIDE B/W R-TO-R SOT23-5
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 4 V/µs
增益帶寬積: 10MHz
電流 - 輸入偏壓: 50nA
電壓 - 輸入偏移: 350µV
電流 - 電源: 1mA
電流 - 輸出 / 通道: 50mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 6.5 V,±1.35 V ~ 3.25 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: SC-74A,SOT-753
供應(yīng)商設(shè)備封裝: SOT-23-5
包裝: 帶卷 (TR)
MAX4130–MAX4134
Single/Dual/Quad, Wide-Bandwidth, Low-Power,
Single-Supply, Rail-to-Rail I/O Op Amps
16
______________________________________________________________________________________
SOT23,
8L
.EPS
REV.
DOCUMENT CONTROL NO.
APPROVAL
PROPRIETARY INFORMATION
TITLE:
3.00
2.60
E
C
E1
E
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
8. MEETS JEDEC MO178.
8
0.60
1.75
0.30
L2
0
e1
e
L
1.50
E1
0.65 BSC.
1.95 REF.
0.25 BSC.
GAUGE PLANE
SEATING PLANE C
C
L
PIN 1
I.D. DOT
(SEE NOTE 6)
L
C
L
C
A2
e1
D
DETAIL "A"
5. COPLANARITY 4 MILS. MAX.
NOTE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
6. PIN 1 I.D. DOT IS 0.3 MM MIN. LOCATED ABOVE PIN 1.
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
1. ALL DIMENSIONS ARE IN MILLIMETERS.
L2
L
A1
A
0.45
1.30
0.15
1.45
MAX
0.28
b
0.90
A2
0.00
A1
0.90
A
MIN
SYMBOL
3.00
0.20
2.80
D
0.09
C
SEE DETAIL "A"
L
C
b
e
D
1
21-0078
1
PACKAGE OUTLINE, SOT-23, 8L BODY
0
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
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