參數(shù)資料
型號(hào): MAX3355EEUD
廠商: MAXIM INTEGRATED PRODUCTS INC
元件分類: 電源管理
英文描述: +/-15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14
封裝: 4.40 MM, TSSOP-14
文件頁(yè)數(shù): 2/11頁(yè)
文件大小: 228K
代理商: MAX3355EEUD
M
±15kV ESD-Protected USB On-the-Go
Charge Pump and Comparators in UCSP
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND)
V
CC
, V
L
, V
BUS
, ID_IN.............................................-0.3V to +6.0V
C+..................................................................(V
CC
- 0.3V) to +6V
C-................................................................-0.3V to (V
CC
+ 0.3V)
OFFVBUS
,
SHDN
, STATUS1,
STATUS2, ID_OUT....................................-0.3V to (V
L
+ 0.3V)
V
BUS
Short Circuit to GND.........................................Continuous
Output Current (all other pins)..........................................±15mA
Continuous Power Dissipation (T
A
= +70
°
C)
4 x 3 UCSP (derate 6.5mW/
°
C above +70
°
C) .............520mW
ELECTRICAL CHARACTERISTICS
(V
CC
= +2.6V to +5.5V, V
L
= +1.65V to V
CC
, C1 = 0.1μF, V
CC
decoupled with 1μF capacitor to GND, V
L
decoupled with 0.1μF
capacitor to GND, C
LOAD
= 1μF (min), ESR
LOAD
= 1
(max), T
A
= T
MIN
to T
MAX
. Typical values are at V
CC
= +3.0V, V
L
= 1.8V, T
A
=
+25
°
C, unless otherwise noted.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
14-Pin TSSOP (derate 9.1mW/
°
C above +70
°
C) .........727mW
Operating Temperature Range ...........................-40
°
C to +85
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Junction Temperature......................................................+150
°
C
Lead Temperature (soldering, 10s).................................+300
°
C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+200
°
C
Vapor Phase (20s) .......................................................+215
°
C
PARAMETER
SYMBOL
V
CC
V
L
I
L
CONDITIONS
MIN
2.6
1.65
TYP
MAX
5.5
V
CC
100
UNITS
V
V
μA
Supply Voltage
Logic Supply Voltage
Logic Supply Current
No activity on V
BUS
; comparator and
reference active
200
μA
Operating Supply Current
I
CC
Device A configured,
OFFVBUS
= V
L
,
I
LOAD
= 8mA, charge pump on
Device B configured,
SHDN
= GND
Device A configured,
SHDN
= GND
20
mA
1
Shutdown Supply Current
I
CC
SHDN
30
μA
Thermal-Shutdown Protection
Threshold
Device A configured,
OFFVBUS
= V
L
,
charge pump on
+150
°
C
Thermal-Shutdown Protection
Hysteresis
Device A configured,
OFFVBUS
= V
L
,
charge pump on
+20
°
C
LOGIC INPUTS AND OUTPUTS
V
OH
V
OL
V
IH
V
IL
I
LKG
I
SOURCE
= +1mA
I
SINK
= -1mA
2/3 x V
L
STATUS1, STATUS2, ID_OUT
Output Voltage
0.4
V
2/3 x V
L
OFFVBUS
,
SHDN
Input Voltage
0.4
±1
V
Input Leakage Current
V
BUS
OUTPUT VOLTAGE: DEVICE A CONFIGURED
OFFVBUS,
SHDN
= GND or V
L
μA
I
LOAD
= 0 to 8mA, C
LOAD
= 1μF,
OFFVBUS
= V
L
, ID_IN = GND
4.63
5.25
V
BUS
Output Voltage
No load, C
LOAD
= 1μF,
OFFVBUS
= V
L
,
ID_IN = GND
4.8
V
V
BUS
Leakage Voltage
V
BUS
Sink Current
OFFVBUS
= GND
OFFVBUS
= GND, V
BUS
= +6.0V
200
150
mV
μA
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