- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384661 > MAX3207EAUT-T (MAXIM INTEGRATED PRODUCTS INC) Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs PDF資料下載
參數(shù)資料
| 型號： | MAX3207EAUT-T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs |
| 中文描述： | UNIDIRECTIONAL, SILICON, TVS DIODE, MO-178AB |
| 封裝： | SOT-23, 6 PIN |
| 文件頁數(shù)： | 7/13頁 |
| 文件大?。?/td> | 303K |
| 代理商： | MAX3207EAUT-T |
Layout Recommendations
Proper circuit-board layout is critical to suppress ESD-
induced line transients (See Figure 6). The MAX3205E/
MAX3207E/MAX3208E clamp to 100V; however, with
improper layout, the voltage spike at the device can be
much higher. A lead inductance of 10nH with a 45A
current spike results in an additional 450V spike on the
protected line. It is essential that the layout of the PC
board follows these guidelines:
1) Minimize trace length between the connector or
input terminal, I/O_, and the protected signal line.
2) Use separate planes for power and ground to reduce
parasitic inductance and to reduce the impedance to
the power rails for shunted ESD current.
3) Ensure short low-inductance ESD transient return
paths to GND and V
CC
.
4) Minimize conductive power and ground loops.
5) Do not place critical signals near the edge of the PC
board.
6) Bypass V
CC
to GND with a low-ESR ceramic capaci-
tor as close to V
CC
as possible.
7) Bypass the supply of the protected device to GND
with a low-ESR ceramic capacitor as close to the
supply pin as possible.
UCSP Applications Information
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout, and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, go to the Maxim
website at www.maxim-ic.com/ucsp for the Application
Note,
UCSP—A Wafer-Level Chip-Scale Package
.
Chip Information
DIODE COUNT:
MAX3205E: 7
MAX3207E: 3
MAX3208E: 5
PROCESS: BiCMOS
M
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________
7
V
CC
PROTECTED LINE
NEGATIVE ESD-
CURRENT
PULSE
PATH TO
GROUND
PROTECTED
CIRCUIT
GND
D1
I/O_
V
C
D2
L1
L3
L2
Figure 6. Layout Considerations
MAX3205E
MAX3207E
MAX3208E
0.1
μ
F
0.1
μ
F
I/0_
I/0
I/0 LINE
V
CC
V
CC
PROTECTED
CIRCUIT
Typical Operating Circuit
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX3208EATE | Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs |
| MAX3208EAUB | Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs |
| MAX3207EAUT | Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs |
| MAX3205E | Dual LVDS Transmitter 8-SOIC -40 to 85 |
| MAX3207E | Dual LVDS Transmitter 8-SOIC -40 to 85 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3208EATE | 功能描述:TVS二極管陣列 RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| MAX3208EATE+ | 功能描述:TVS二極管陣列 4Ch Differential ESD Protection IC RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| MAX3208EATE+T | 功能描述:TVS二極管陣列 4Ch Differential ESD Protection IC RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| MAX3208EATE-T | 功能描述:TVS二極管陣列 RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
| MAX3208EAUB | 功能描述:TVS二極管陣列 RoHS:否 制造商:Littelfuse 極性: 通道:4 Channels 擊穿電壓: 鉗位電壓:11.5 V 工作電壓:2.5 V 峰值浪涌電流:20 A 安裝風(fēng)格:SMD/SMT 端接類型:SMD/SMT 系列: 最小工作溫度:- 40 C 最大工作溫度:+ 85 C |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。