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參數(shù)資料
| 型號(hào)： | MAX2247EBC-T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 衰減器 |
| 英文描述： | 2.4GHz SiGe Linear Power Amplifier |
| 中文描述： | 2400 MHz - 2500 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 4 X 3 MM, UCSP-12 |
| 文件頁(yè)數(shù)： | 9/10頁(yè) |
| 文件大?。?/td> | 770K |
| 代理商： | MAX2247EBC-T |
Ground Vias
To achieve optimum gain, output power, thermal perfor-
mance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
UCSP Reliability
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is inte-
grally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
consideration for a UCSP. UCSP solder-joint contact
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reli-
ably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings
section for any specific lim-
itations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
Chip Information
TRANSISTOR COUNT: 1425
M
2.4GHz SiGe Linear Power Amplifier
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX2247EBC-T10 | 功能描述:射頻放大器 2.4GHz SiGe Linear Power Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| MAX2247EVKIT | 功能描述:放大器 IC 開(kāi)發(fā)工具 MAX2247 Eval Kit RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V |
| MAX2247EWC+ | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX2247EWC+T | 功能描述:射頻放大器 2.4GHz SiGe Linear Power Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| MAX225 | 制造商:MAXIM 制造商全稱:Maxim Integrated Products 功能描述:+5V-Powered, Multichannel RS-232 Drivers/Receivers |
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