參數(shù)資料
型號(hào)： MAX2077CTN+T
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/20頁(yè)
文件大?。?/td> 0K
描述： IC FRONT-END ULTRASOUND 56TQFN
應(yīng)用說(shuō)明： Ultrasound Imaging Systems Application Note
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 2,500
類(lèi)型： 超聲波接收器
應(yīng)用： 醫(yī)療用超聲波成像，聲納
安裝類(lèi)型： 表面貼裝
封裝/外殼： 56-WFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝： 56-TQFN-EP（8x8）
包裝： 帶卷 (TR)
MAX2077
Octal-Channel Ultrasound Front-End
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuits, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,
NP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless otherwise noted.) (Note 5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Note 2: Junction temperature TJ = TC + (
θJC x VCC x ICC). This formula can only be used if the component is soldered down to a print-
ed circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 4: Junction temperature TJ = TA + (
θJA x VCC x ICC), assuming there is no heat removal from the exposed pad. The junction
temperature must not exceed 150°C.
VCC_ to GND .........................................................-0.3V to +5.5V
VCC2 - VCC1......................................................................> -0.3V
ZF_, IN_, AG to GND ................................-0.3V to (VCC_ + 0.3V)
INC_ ..............................................................................20mA DC
VREF to GND.............................................................-0.3V to +3V
IN_ to AG ...............................................................-0.6V to +0.6V
OUT_, DIN, DOUT, VG_, NP, CS, CLK,
PD to GND ..........................................-0.3V to (VCC1 + 0.3V)
VCC_, VREF analog and digital control signals must be applied
in this order
Input Differential Voltage ................................2.0VP-P differential
Continuous Power Dissipation (TA = +70°C)
56-Pin TQFN (derate 47.6mW/°C above +70°C) ..............3.8W
68-Pin TQFN (derate 40.0mW/°C above +70°C) ..............4.0W
Operating Temperature Range (Note 1).................0°C to +70°C
Junction Temperature ......................................................+150°C
θJC (Notes 2, 3) (56-Pin TQFN)..........................................1°C/W
θJC (Notes 2, 3) (68-Pin TQFN).......................................0.3°C/W
θJA (Notes 3, 4) (56-Pin TQFN) ........................................21°C/W
θJA (Notes 3, 4) (68-Pin TQFN) ........................................20°C/W
Storage Temperature Range .............................-40°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
3.3V Supply Voltage
VCC1
3.13
3.3
3.47
V
4.75V/5V Supply Voltage
VCC2
4.5
4.75
5.25
V
External Reference Voltage
Range
VREF
(Note 6)
2.475
2.525
V
CMOS Input High Voltage
VIH
Applies to CMOS control inputs
2.5
V
CMOS Input Low Voltage
VIL
Applies to CMOS control inputs
0.8
V
CMOS Input Leakage Current
IIN
0V to 3.3V
10
μA
Data Output High Voltage
DOUT_HI
10M
load
VCC1
V
Data Output Low Voltage
DOUT_LO
10M
load
0
V
4.75V/5V Supply Standby Current
I_NP_5V_TOT
NP = 1, all channels
3.9
6
mA
3V Supply Standby Current
I_NP_3V_TOT
NP = 1, all channels
1.7
3
mA
4.75V/5V Power-Down Current
I_PD_5V_TOT
PD = 1, all channels (Note 7)
0.4
10
μA
3V Power-Down Current
I_PD_3V_TOT
PD = 1, all channels (Note 7)
0.3
10
μA
3V Supply Current per Channel
I_3V_NM
Total I divided by 8, VG+ - VG- = -2V
11
18
mA
4.75V/5V Supply Current per
Channel
I_5V_NM
Total I divided by 8
6.0
8.3
mA
DC Power per Channel
P_NM
64.8
105
mW
Differential Analog Control
Voltage Range
VGAIN_RANG
VG+ - VG-
±3
V
相關(guān)PDF資料
PDF描述
MAX2078CTK+T IC FRNT-END ULTRASOUND 8CH 68QFN
MAX3012EUP+ IC TRANSLATOR LEVEL 8CH 20-TSSOP
MAX3013ETP+T IC TRANSLATOR LEVEL 8CH 20-TQFN
MAX3023EUD+T IC TRANSLATOR LVL 100MBPS 14TSSO
MAX31D80T-UGQ+ IC CLOCK GEN PLL 1:2 10TDFN-EP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX2077EVKIT# 功能描述:射頻前端 Octal-Channel Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32
MAX2078 制造商:MAXIM 制造商全稱(chēng):Maxim Integrated Products 功能描述:Octal-Channel Ultrasound Front-End with CW Doppler Mixers
MAX2078CTK+ 功能描述:射頻前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32
MAX2078CTK+T 功能描述:射頻前端 8Ch Ultrasound Front-End RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32
MAX2078EVKIT 功能描述:射頻前端 Ultrasound Integrated Analog Front End Octal LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類(lèi)型: 工作頻率:2.4 GHz, 5 GHz 最大數(shù)據(jù)速率:54 Mbps 噪聲系數(shù): 工作電源電壓:3.3 V 電源電流:180 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-32
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*