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參數(shù)資料
| 型號： | MAX2021ETX |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | High-Dynamic-Range, Direct Up-/Downconversion 750MHz to 1200MHz Quadrature Mod/Demod |
| 中文描述： | TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC36 |
| 封裝： | 6 X 6 MM, TQFN-36 |
| 文件頁數(shù)： | 11/14頁 |
| 文件大小： | 242K |
| 代理商： | MAX2021ETX |
M
High-Dynamic-Range, Direct Up-/Downconversion
750MHz to 1200MHz Quadrature Mod/Demod
______________________________________________________________________________________
11
R2, and R3. Tables 1 and 2 outline the performance
trade-offs that can be expected for various combina-
tions of these bias resistors. As noted within the tables,
the performance trade-offs may be more pronounced
for different operating frequencies. Contact the factory
for additional details.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed paddle
MUST
be connected to
the ground plane of the PC board. It is suggested that
multiple vias be used to connect this pad to the lower-
level ground planes. This method provides a good
RF/thermal conduction path for the device. Solder the
exposed pad on the bottom of the device package to
the PC board. The MAX2021 evaluation kit can be used
as a reference for board layout. Gerber files are avail-
able upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass all VCC_ pins with
33pF and 0.1μF capacitors placed as close to the pins
as possible. The smallest capacitor should be placed
closest to the device.
To achieve optimum performance, use good voltage-
supply layout techniques. The MAX2021 has several RF
processing stages that use the various VCC_ pins, and
while they have on-chip decoupling, off-chip interaction
between them may degrade gain, linearity, carrier sup-
pression, and output power-control range. Excessive
coupling between stages may degrade stability.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2021’s 36-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PC board on which the IC is mounted
be designed to conduct heat from this contact. In addi-
tion, the EP provides a low-inductance RF ground path
for the device.
The exposed paddle (EP)
MUST
be soldered to a
ground plane on the PC board either directly or through
an array of plated via holes. An array of 9 vias, in a 3 x
3 array, is suggested. Soldering the pad to ground is
critical for efficient heat transfer. Use a solid ground
plane wherever possible.
Note:
V
CC
= 5V, P
LO
= 0dBm, T
A
= +25°C, I/Q voltage levels = 1.4V
P-P
differential.
LO FREQ
(MHz)
RF FREQ
(MHz)
R1
(
)
420
453
499
549
650
R2
(
)
620
665
698
806
1000
R3
(
)
330
360
402
464
550
I
CC
(mA)
OIP3
(dBm)
LO LEAK
(dBm)
IMAGE REJ
(dBc)
OIP2
(dBm)
271
253
229
205
173
19.6
21.9
18.9
15.7
13.6
-32.1
-32.7
-33.7
-34.4
-34.2
23.9
34.0
30.0
23.7
23.3
50.5
51.0
52.6
46.0
32.3
800
801.8
420
453
499
549
650
620
665
698
806
1000
330
360
402
464
550
271
253
229
205
173
20.7
21.6
20.6
19.0
14.9
-31.4
-31.6
-31.8
-31.9
-30.5
43.4
42.4
42.7
40.3
25.0
54.0
55.4
59.8
50.7
34.6
900
901.8
420
453
499
549
650
620
665
698
806
1000
330
360
402
464
550
271
253
229
205
173
22.4
22.2
19.9
17.6
14.6
-32.8
-33.2
-33.8
-34.8
-33.9
39.3
39.1
43.5
40.5
36.8
55.5
56.3
55.0
51.4
32.8
1000
1001.8
Table 1. Typical Performance Trade-Offs as a Function of Current Draw—Modulator Mode
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