20
Maxim Integrated
MAX19792
500MHz to 4000MHz Dual Analog Voltage Variable
Attenuator with On-Chip 10-Bit SPI-Controlled DAC
Table 7. Typical Application Circuit
Component Values
Layout Considerations
A properly designed PCB is an essential part of any RF/
microwave circuit. Keep RF signal lines as short as pos-
sible to reduce losses, radiation, and inductance. For best
performance, route the ground-pin traces directly to the
exposed pad underneath the package. This pad MUST
be connected to the ground plane of the board by using
multiple vias under the device to provide the best RF and
thermal conduction path. Solder the exposed pad on the
bottom of the device package to a PCB. Pins 4 and 31
for the MAX19792 have no internal connection. These two
pins are in place to support the MAX19794 part in the fam-
ily. The MAX19794 requires an additional bypass capaci-
tor on each of these pins for proper operation. If desired
to have a common layout to support the MAX19794, then
include these capacitors in the common layout. Refer to
the MAX19794 data sheet for details.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V
CC
pin with
capacitors placed as close as possible to the device.
Place the smallest capacitor closest to the device. See
the Typical Application Circuit and Table 7 for details.
Exposed Pad RF and
Thermal Considerations
The exposed pad (EP) of the devices 36-pin TQFN pack-
age provides a low thermal-resistance path to the die. It
is important that the PCB on which the IC is mounted be
designed to conduct heat from this contact.
In addition, provide the EP with a low-inductance RF
ground path for the device. The EP must be soldered to
a ground plane on the PCB, either directly or through an
array of plated via holes. Soldering the pad to ground is
also critical for efficient heat transfer. Use a solid ground
plane wherever possible.
*Add two additional 10I series resistors between V
CC
s lead-
ing to C5 and C6, unless a V
CC
power plane is used.
DESIGNATION    QTY
DESCRIPTION
C1, C2, C4
3
22pF Q5%, 50V C0G ceramic
capacitors (0402)
C3
1
22pF Q5%, 50V C0G ceramic
capacitors (0402)
Not installed for two attenuators
in cascade.
C5C9
5
1000pF Q5%, 50V C0G ceramic
capacitors (0402)
C12
1
120pF Q5%, 50V C0G ceramic
capacitor (0402)
Provides some external noise
filtering along with R3.
C13
0
Not installed, 4.7pF capacitor
could be used to reduce any
potential rise time glitching when
the comparator changes state.
R1, R2
2
10I Q5% resistors* (0402)
R3
1
200I Q5% resistor (0402)
Use this resistor to provide some
lowpass noise filtering when used
with C12. The value of R3 slows
down the response time. R3 also
provides protection for the device
in case V
CTRL
is applied without
V
CC
present.
U1
1
Maxim MAX19792