
M
Integrated Temperature
Controllers for Peltier Modules
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND..............................................................-0.3V to +6V
SHDN
, MAXV, MAXIP, MAXIN,
CTLI,
OT
,
UT
to GND............................................-0.3V to +6V
FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-,
AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-,
DIFOUT to GND......................................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to V
DD
...........................................-0.3V to +0.3V
PV
DD
1, PV
DD
2 to GND...............................-0.3V to (V
DD
+ 0.3V)
PGND1, PGND2 to GND.......................................-0.3V to +0.3V
COMP, REF, ITEC,
OT
,
UT
, INTOUT, DIFOUT,
BFB-, BFB+, AOUT Short to GND .............................Indefinite
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
1 = PV
DD
2 =
SHDN
= 5V, FREQ = GND, CTLI = FB+ = FB- = MAXV = MAXIP = MAXIN = REF,
T
A
= 0
°
C to +85
°
C
,
unless otherwise noted. Typical values at T
A
= +25
°
C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Peak LX Current (MAX1978) (Note 1).................................±4.5A
Peak LX Current (MAX1979) (Note 1)....................................+9A
Continuous Power Dissipation (T
A
= +70
°
C)
48-Lead Thin QFN-EP
(derate 26.3mW/
°
C above +70
°
C) (Note 2).................2.105W
Operating Temperature Ranges
MAX1978ETM..................................................-40
°
C to +85
°
C
MAX1979ETM..................................................-40
°
C to +85
°
C
Maximum Junction Temperature .....................................+150
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Lead Temperature (soldering, 10s).................................+300
°
C
PARAMETER
SYMBOL
V
DD
CONDITIONS
MIN
3.0
TYP
MAX
5.5
UNITS
V
Input Supply Range
V
DD
= 5V, I
TEC
= 0 to ±3A,
V
OUT
= V
OS1
- V
OS2
(MAX1978)
-4.3
+4.3
V
DD
= 5V, I
TEC
= 0 to 6A,
V
OUT
= V
OS1
(MAX1979)
4.3
V
DD
= 3V, I
TEC
= 0 to ±3A,
V
OUT
= V
OS1
- V
OS2
(MAX1978)
-2.3
+2.3
Output Voltage Range
V
OUT
V
DD
= 3V, I
TEC
= 0 to 6A,
V
OUT
= V
OS1
(MAX1979)
MAX1978
MAX1979
V
DD
= 3V to 5.5V, I
REF
= 150μA
V
DD
= 3V to 5.5V, I
REF
= +10μA to -1mA
2.3
V
±
3
6
Maximum TEC Current
I
TEC(MAX)
A
Reference Voltage
Reference Load Regulation
V
REF
V
REF
1.485
1.500
1.2
150
50
150
50
0.04
0.06
0.06
0.09
0.02
1
1.515
5
160
60
160
60
0.07
0.08
0.10
0.12
10
V
mV
V
MAXI_
= V
REF
V
MAXI_
= V
REF
/3
V
MAXI_
= V
REF
V
MAXI_
= V
REF
/3
135
40
135
40
V
OS1
< V
CS
Current-Sense Threshold
V
OS1
> V
CS
mV
V
DD
= 5V, I = 0.5A
V
DD
= 3V, I = 0.5A
V
DD
= 5V, I = 0.5A
V
DD
= 3V, I = 0.5A
V
LX
= V
DD
= 5V, T
A
= +25
°
C
V
LX
= V
DD
= 5V, T
A
= +85
°
C
NFET On-Resistance
R
DS(ON-N)
PFET On-Resistance
R
DS(ON-P)
NFET Leakage
I
LEAK(N)
μA
Note 1:
LX has internal clamp diodes to PGND and PV
DD
. Applications that forward bias these diodes should not exceed the IC
’
s
package power dissipation limits.
Note 2:
Solder underside metal slug to PC board ground plane.