參數(shù)資料
型號(hào)： MAX14803CCM+
廠商： Maxim Integrated Products
文件頁(yè)數(shù)： 12/20頁(yè)
文件大小： 0K
描述： IC SWITCH SPST 48LQFP
應(yīng)用說(shuō)明： Ultrasound Imaging Systems Application Note
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 250
功能： 開(kāi)關(guān)
電路： 單刀單擲
導(dǎo)通狀態(tài)電阻： 48 歐姆
電壓電源： 單電源
電壓 - 電源，單路/雙路(±)： 2.7 V ~ 5.5 V
電流 - 電源： 5µA
工作溫度： 0°C ~ 70°C
安裝類型： 表面貼裝
封裝/外殼： 48-LQFP
供應(yīng)商設(shè)備封裝： 48-LQFP（7x7）
包裝： 托盤
MAX14802/MAX14803/MAX14803A
Low-Charge Injection, 16-Channel,
High-Voltage Analog Switches
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +5.5V, VPP = +40V to VNN + 250V, VNN = -40V to -160V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
(All voltages referenced to GND.)
VDD Logic-Supply Voltage .......................................-0.3V to +7V
VPP - VNN Supply Voltage
(MAX14802CCM+, MAX14803CCM+)..............................260V
(MAX14802ECM+, MAX14803AEWZ+) ............................230V
VPP Positive-Supply Voltage.................................-0.3V to +220V
VNN Negative-Supply Voltage ...............................-0.3V to -220V
Logic Inputs (LE, CLR, CLK, DIN, DOUT)................-0.3V to +7V
COM_, NO_...............................(-0.3V + VNN) to the minimum of
[(VNN + 220V) or (VPP + 0.3V)]
Peak Analog Signal Current Per Channel ................................3A
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP (derate 22.7mW/°C above +70°C).........1818mW
110-Bump WLP (derate 37mW°C above +70°C)........2960mW
Operating Temperature Range (Commercial) ........0°C to +70°C
Operating Temperature Range (Extended).........-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ..................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFP
Junction-to-Ambient Thermal Reistance (
θJA)..............44°C/W
Junction-to-Case Thermal Resistance (
θJC).................10°C/W
WLP
Junction-to-Ambient Thermal Reistance (
θJA)..............27°C/W
Junction-to-Case Thermal Resistance (
θJC)...................1°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLIES
VDD Supply Voltage
VDD
+2.7
+5.5
V
MAX14802ECM+, MAX14803AEWZ+
+40
+100
VNN +
200
VPP Supply Voltage
VPP
MAX14802CCM+, MAX14803CCM+
+40
+100
VNN +
250
V
VNN Supply Voltage
VNN
-160
-100
0
V
VDD Supply Quiescent
Current
IDDQ
5μA
VDD Supply Dynamic
Current
IDD
VDD = +5V, VLE = +5V, fCLK = 5MHz
0.5
mA
VPP Supply Quiescent
Current
IPPQ
All switches remain on or off, ICOM_ = 5mA
0
10
μA
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