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參數資料
| 型號： | MAX14523BATA+T |
| 廠商： | Maxim Integrated |
| 文件頁數： | 4/11頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CURRENT LIMIT SWITCH 8-DFN |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 功能： | 電流開關 |
| 精確度： | ±10% |
| 輸入電壓： | 1.7 V ~ 5.5 V |
| 電流 - 輸出： | 可調 |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WDFN 裸露焊盤 |
| 供應商設備封裝： | 8-TDFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
MAX14523A/MAX14523AL/MAX14523B/MAX14523C
250mA to 1.5A, Adjustable
Current-Limit Switches
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = +1.7V to +5.5V, RSETI = 94.2k
Ω, CIN = COUT = 1F, and TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values
are at VIN = +3.3V, TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
(All voltages referenced to GND.)
IN, ON, ON, FLAG, OUT, and SETI to GND .............-0.3V to +6V
Current into Any Pin (Except IN, OUT)................................20mA
Out Short Circuit to GND...................................Internally Limited
Continuous Power Dissipation (TA = +70°C) for multilayer board:
TDFN (derate 24.4mW/°C above +70°C)...................1952mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (
θJA) ...........41°C/W
Junction-to-Case Thermal Resistance (
θJC) ..................8°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY OPERATION
Operating Voltage
VIN
1.7
5.5
V
Quiescent Current
IQ
IOUT = 0A, switch on, VIN = 3.3V
170
300
μA
Latchoff Current
ILATCH
VIN = 3.3V, IOUT = 0A , after an overcurrent
fault (MAX14523B)
10
20
μA
Shutdown Forward Current
ISHDN
VON = 0V, VON = VIN, VIN = 5.5V, VOUT = 0V
0.5
7
μA
Shutdown Reverse Current
IRSHDN
VON = 0V, VON = VIN, VIN = 1.7V, VOUT =
5.5V (current into OUT)
0.01
0.6
μA
INTERNAL FET
Switch-On Resistance
RON
VIN = 3.3V, IOUT lower than ILIM
70
130
m
RSETI = 91.78k , VIN - VOUT = 1V
1350
1500
1650
Forward-Current Limit
ILIM
RSETI = 563.12k , VIN - VOUT = 1V
225
250
275
mA
(RSETI +2.48k ) × ILIM Product
ILIM = 250mA to 1500mA,
VIN - VOUT = 1V
127.2
141.4
155.5
kV
Reverse Blocking Current
VOUT > VIN + 140mV, after reverse-current-
limit shutdown
2
μA
Reverse Blocking Threshold
VOUT - VIN
VOUT - VIN = 300mV, OUT falling until
switch turns on
40
95
140
mV
FLAG Assertion Drop Voltage
Threshold
VFA
Increase (VIN - VOUT) drop until
FLAG
asserts, IOUT limiting, VIN = 3.3V
350
mV
ON,
ON INPUT
ON,
ON Input Leakage
ILEAK
VON, VON = VIN or VGND
-1
+1
μA
ON,
ON Input Logic-High Voltage
VIH
1.6
V
ON,
ON Input Logic-Low Voltage
VIL
0.4
V
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