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參數(shù)資料
| 型號： | MAX1183 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Dual 10-Bit, 40Msps, +3V, Low-Power ADC with Internal Reference and Parallel Outputs |
| 中文描述： | 雙路、10位、40Msps、3V、低功耗ADC，內(nèi)置電壓基準及并行輸出 |
| 文件頁數(shù)： | 15/18頁 |
| 文件大?。?/td> | 495K |
| 代理商： | MAX1183 |
quadrature (Q) carrier component, where the Q compo-
nent is 90-degree phase-shifted with respect to the in-
phase component. At the receiver, the QAM signal is
divided down into its I and Q components, essentially
representing the modulation process reversed. Figure 8
displays the demodulation process performed in the
analog domain, using the dual matched +3V, 10-bit
ADC MAX1183 and the MAX2451 quadrature demodu-
lator to recover and digitize the I and Q baseband sig-
nals. Before being digitized by the MAX1183, the
mixed-down signal components may be filtered by
matched analog filters, such as Nyquist or pulse-shap-
ing filters, which remove any unwanted images from the
mixing process, thereby enhancing the overall SNR
performance and minimizing intersymbol interference.
Grounding, Bypassing, and
Board Layout
The MAX1183 requires high-speed board layout design
techniques. Locate all bypass capacitors as close to
the device as possible, preferably on the same side as
the ADC, using surface-mount devices for minimum
inductance. Bypass V
DD
, REFP, REFN, and COM with
two parallel 0.1μF ceramic capacitors and a 2.2μF
bipolar capacitor to GND. Follow the same rules to
bypass the digital supply (OV
DD
) to OGND. Multilayer
boards with separated ground and power planes pro-
duce the highest level of signal integrity. Consider the
use of a split ground plane arranged to match the
physical location of the analog ground (GND) and the
digital output driver ground (OGND) on the ADC
’
s
package. The two ground planes should be joined at a
single point such that the noisy digital ground currents
do not interfere with the analog ground plane. The ideal
location of this connection can be determined experi-
mentally at a point along the gap between the two
ground planes, which produces optimum results. Make
this connection with a low-value, surface-mount resistor
M
Dual 10-Bit, 40Msps, +3V, Low-Power ADC with
Internal Reference and Parallel Outputs
______________________________________________________________________________________
15
MAX1183
T1
N.C.
V
IN
6
1
5
2
4
3
22pF
22pF
0.1
μ
F
0.1
μ
F
2.2
μ
F
25
25
MINICIRCUITS
TT1
–
6
T1
N.C.
V
IN
6
1
5
2
4
3
22pF
22pF
0.1
μ
F
0.1
μ
F
2.2
μ
F
25
25
MINICIRCUITS
TT1
–
6
INA-
INA+
INB-
INB+
COM
Figure 6. Transformer-Coupled Input Drive
MAX1183
0.1
μ
F
1k
1k
100
100
C
IN
22pF
C
IN
22pF
INB+
INB-
COM
INA+
INA-
0.1
μ
F
R
ISO
50
R
ISO
50
REFP
REFN
V
IN
MAX4108
0.1
μ
F
1k
1k
100
100
C
IN
22pF
C
IN
22pF
0.1
μ
F
R
ISO
50
R
ISO
50
REFP
REFN
V
IN
MAX4108
Figure 7. Using an Op Amp for Single-Ended, AC-Coupled
Input Drive
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| MAX11835DEMOKIT+ | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 Demonstration Kit for MAX11835 RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| MAX11835EWA+ | 制造商:Maxim Integrated Products 功能描述: |
| MAX11835EWA+T | 功能描述:觸摸屏轉(zhuǎn)換器和控制器 TacTouch Haptic Actuator Controller RoHS:否 制造商:Microchip Technology 類型:Resistive Touch Controllers 輸入類型:3 Key 數(shù)據(jù)速率:140 SPS 分辨率:10 bit 接口類型:4-Wire, 5-Wire, 8-Wire, I2C, SPI 電源電壓:2.5 V to 5.25 V 電源電流:17 mA 工作溫度:- 40 C to + 85 C 封裝 / 箱體:SSOP-20 |
| MAX11835TEVS+ | 功能描述:觸摸屏轉(zhuǎn)換器和控制器 Evaluation System for MAX11835 RoHS:否 制造商:Microchip Technology 類型:Resistive Touch Controllers 輸入類型:3 Key 數(shù)據(jù)速率:140 SPS 分辨率:10 bit 接口類型:4-Wire, 5-Wire, 8-Wire, I2C, SPI 電源電壓:2.5 V to 5.25 V 電源電流:17 mA 工作溫度:- 40 C to + 85 C 封裝 / 箱體:SSOP-20 |
| MAX11836EWA+T | 制造商:Maxim Integrated Products 功能描述: 制造商:Maxim Integrated Products 功能描述:DUAL 10-BIT 40MSPS 3V LOW-POWER ADC WITH INTERNAL REFER - Tape and Reel |
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