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參數資料
| 型號： | MASW-008902-000D3K |
| 元件分類： | 開關 |
| 英文描述： | 2400 MHz - 2500 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 0.75 dB INSERTION LOSS |
| 封裝： | ROHS COMPLIANT, FLIP-CHIP-8 |
| 文件頁數： | 1/4頁 |
| 文件大?。?/td> | 152K |
| 代理商： | MASW-008902-000D3K |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
1
Bumped GaAs SP3T Switch for WLAN
2.4 - 2.5 GHz
M/A-COM Products
Rev. V2
MASW-008902-000DIE
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Features
802.11b/g and Bluetooth Applications
Insertion Loss: 0.60 dB typical
Isolation:
31.5 dB typical (RX Path)
22.0 dB typical (TX / BT paths)
Flip-chip configuration
RoHS* Compliant
Description
M/A-COM’s MASW-008902-000DIE is a bumped
single band GaAs pHEMT MMIC SP3T switch.
Typical applications are for single band 2.4 GHz
WLAN (802.11 b/g) and Bluetooth applications.
The MASW-008902-000DIE delivers high isolation,
low insertion loss, and high linearity at 2.4 - 2.5 GHz.
The MASW-008902-000DIE is fabricated using a 0.5
micron gate length GaAs pHEMT process.
The
process features full passivation for performance
and reliability. This die features SnAg (2.5 %) solder
bump for flip-chip on lead frame package or WLCSP.
*
Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
Ordering Information 1
Part Number
Package
MASW-008902-000DIE
Separated Die on Grip Ring
MASW-008902-000D3K
Die on 3000 piece reel
1. Die quantity varies.
Die Bumping Pad Layout (bump side up)
Die Bumping Pad Configuration
Parameter
Absolute Maximum
Input Power @ 3 V Control
+32 dBm
Input Power @ 5 V Control
+35 dBm
Operating Voltage
+8 volts
Operating Temperature
-40°C to +85°C
Storage Temperature
-65°C to +150°C
Absolute Maximum Ratings 2,3
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. M/A-COM does not recommend sustained operation near
these survivability limits.
Name
Description
VC1
Voltage Control 1
BT
Blue Tooth TX/RX Port
GND
Ground
TX
2.5 GHz TX Port
VC3
Voltage Control 3
RX
2.5 GHz RX Port
VC2
Voltage Control 2
RFC
Antenna Port
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MASW-008902-000DIE | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz |
| MASW-008902-000DIE_V4 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Bumped GaAs SP3T Switch for WLAN |
| MASW-008902-001SMB | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:Bumped GaAs SP3T Switch for WLAN |
| MASW-008955 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:GaAs SP3T Switch DC - 3.5 GHz |
| MASW-008955-001SMB | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:GaAs SP3T Switch DC - 3.5 GHz |
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