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參數(shù)資料
| 型號(hào)： | MAAPSM0008TR-3000 |
| 英文描述： | 1-Watt Power Amplifier 5 - 6 GHz |
| 中文描述： | 1瓦功率放大器5 - 6千兆赫 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大?。?/td> | 220K |
| 代理商： | MAAPSM0008TR-3000 |
1-Watt, 5 GHz Power Amplifier
MAAPSM0008
Specifications subject to change without notice.
n
North America:
Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
V 1.1
Application Information
Notes on board design
1.
Sample board uses RO4350 e
r
= 3.48 as dielec-
tric for circuit board. Dielectric thickness is not
critical but RFin and RFout transmission lines
should be 50 ohms (w = 22 mil for thickness = 10
mil).
2.
Solder the exposed paddle on the back of the
package to the board. Proper attachment of the
exposed paddle is essential for RF and DC
ground in addition to providing a low thermal re-
sistance.
3.
Case temperature (Tc) is measured as shown on
the application board drawing on the top circuit
board metal as close to the body of the package
as possible.
4.
The board must provide adequate heat sinking to
accommodate the 2.5 W typically dissipated un-
der small signal conditions. Sample board uses
vias in the vicinity of the ground pad to provide a
suitable heat sink connected to the ground plane
of the board as shown above (recommend
theta
CA
= 5 °C/W max).
5.
Placement of C1, C2 and R1 are not critical but
use of 1206 for the bypass caps (C1 and C2) is
critical.
Sample Board
3
C2
C1
R1
Plated
Via s
Vias
Plated Vias
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| MAAVCC0001-TB | GT 5C 5#16S PIN PLUG |
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| MAAVCC0002-TB | GT 3C 3#16S PIN PLUG |
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