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參數(shù)資料
| 型號(hào)： | MAAM-007524-DIE000 |
| 元件分類： | 放大器 |
| 英文描述： | 10000 MHz - 15400 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT PACKAGE |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 247K |
| 代理商： | MAAM-007524-DIE000 |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
information contained herein without notice.
8
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Amplifier, Driver
10.0—15.4 GHZ
M/A-COM Products
RoHS Compliant
MAAM-007524-DIE000
Part Status: Preliminary
Rev. A
Figure 22. Recommended operational configuration. Wire bond as shown
.
Assembly Instructions:
Die Attach:
Use AuSn (80/20) 1 mil. preform solder. Limit time @ 310 °C to less than
7 minutes. Refer to Application Note AN3017 for more detailed information.
Wirebonding:
Bond @ 160 °C using standard ball or thermal compression wedge
bond techniques. For DC pad connections, use either ball or wedge bonds. For best
RF performance, use wedge bonds of shortest length, although ball bonds are also
acceptable.
Assembly and Bonding Diagram
Die Handling:
Refer to Application Note AN3016.
RF ports are internally DC blocked.
100 pF
RFIN
RFOUT
VDD
(8V)
0.1 F
Alternate VDD
(5-7V)
100 pF
0.1 F
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