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參數(shù)資料
| 型號(hào)： | MA4SPS552 |
| 元件分類： | PIN二極管 |
| 英文描述： | 200 V, SILICON, PIN DIODE |
| 封裝： | DIE-2 |
| 文件頁數(shù)： | 1/6頁 |
| 文件大小： | 152K |
| 代理商： | MA4SPS552 |
Features
n
Surface Mount Device
n
No Wirebonds Required
n
Rugged Silicon-Glass Construction
n
Silicon Nitride Passivation
n
Polymer Scratch Protection
n
Low Parasitic Capacitance and Inductance
n
High Power Handling (Efficient Heatsinking)
Description
This device is a silicon-glass PIN diode chip fabricated with
M/A-COM’s patented HMIC process.
This device features
two silicon pedestals embedded in a low loss glass. The diode
is formed on the top of one pedestal and connections to the
backside of the device are facilitated by making the pedestal
sidewalls conductive. Selective backside metalization is
applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer
layer for scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge during
handling and assembly.
Applications
These packageless devices are suitable for usage in moderate
incident power (5 W C.W.) or higher incident peak power
(200 W) series, shunt, or series-shunt switches. Small parasitic
inductance, 0.7 nH, and excellent RC time constant, 0.20 pS,
make the devices ideal for wireless TR switch and accessory
switch circuits, where higher P1dB and IP3 values are required.
These diodes can also be used in
π, T, tapered resistance, and
switched-pad attenuator control circuits for 50
or 75
systems.
Surface Mount Monolithic
PIN Diode Chip
MA4SPS552
Case Style ODS-1281
Parameter
Absolute Maximum
Forward Current
100 mA
Reverse Voltage
-200 V
Operating Temperature
-65 °C to +150 °C
Storage Temperature
-65 °C to +150 °C
Dissipated RF & DC Power
1 W
Mounting Temperature
+235 °C for 10 seconds
Junction Temperature
+175 °C
Absolute Maximum Ratings
1
@ TA = +25°C (unless otherwise specified)
1. Exceeding these limits may cause permanent damage.
1. Backside metal: 0.1 micron thk.
2. Hatched areas indicate bond pads.
Dim
Inches
Millimeters
Min.
Max.
Min.
Max.
A
0.0207
0.0226
0.525
0.575
B
0.0108
0.0128
0.275
0.325
C
0.0040
0.0080
0.102
0.203
D
0.0069
0.0089
0.175
0.225
E
0.0018
0.0037
0.045
0.095
F
0.0061
0.0081
0.155
0.205
G
0.0069
0.0089
0.175
0.225
V 1.00
A
B
C
D
E
F
G
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MA4SPS552-T | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:SURMOUNTTM PIN Diode |
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