參數(shù)資料
型號(hào)： M74HC259
廠商： 意法半導(dǎo)體
英文描述： 8 Bit Addressable Latch(八位可尋址鎖存器)
中文描述： 8位可尋址鎖存器（八位可尋址鎖存器）
文件頁(yè)數(shù)： 19/24頁(yè)
文件大小： 107K
代理商： M74HC259
1999 Aug 05
19
Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I
2
C-bus
PCF8575C
14.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
PCF8575C Remote 16-bit I/O expander for I2C-bus
M74HC273 Octal D Type Flip Flop with Clear(帶清除端的八D觸發(fā)器)
M74HC354 Octal Channel Multiplexer/Register(8通道多路復(fù)用器/寄存器(三態(tài)))
M74HC356 Octal Channel Multiplexer/Register(8通道多路復(fù)用器/寄存器帶鎖存(三態(tài)))
M74HC365 Hex Bus Buffer (3-STATE)(六總線緩沖器(同相))
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M74HC259B1R 功能描述:閉鎖 8-Bit Addrsble Latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類(lèi)型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
M74HC259B1R 制造商:STMicroelectronics 功能描述:IC 74HC CMOS 74HC259 DIP16 6V
M74HC259C1R 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:8 BIT ADDRESSABLE LATCH
M74HC259M1R 功能描述:閉鎖 8-Bit Addrsble Latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類(lèi)型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
M74HC259RM13TR 功能描述:閉鎖 8-Bit Addrsble Latch RoHS:否 制造商:Micrel 電路數(shù)量:1 邏輯類(lèi)型:CMOS 邏輯系列:TTL 極性:Non-Inverting 輸出線路數(shù)量:9 高電平輸出電流: 低電平輸出電流: 傳播延遲時(shí)間: 電源電壓-最大:12 V 電源電壓-最小:5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-16 封裝:Reel
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