參數(shù)資料
型號: M68AW256ML70ND6T
廠商: 意法半導(dǎo)體
英文描述: 4 Mbit (256K x16) 3.0V Asynchronous SRAM
中文描述: 4兆位(256K × 16)3.0V異步SRAM
文件頁數(shù): 12/20頁
文件大?。?/td> 161K
代理商: M68AW256ML70ND6T
M68AW256M
12/20
Write Mode
The M68AW256M is in the Write mode whenever
the W and E are Low. Either the Chip Enable input
(E) or the Write Enable input (W) must be de-
asserted
during
Address
subsequent write cycles. When E (W) is Low, and
UB or LB is Low, write cycle begins on the W (E)’s
falling edge. When E and W are Low, and UB = LB
= High, write cycle begins on the first falling edge
of UB or LB. Therefore, address setup time is
referenced to Write Enable, Chip Enable or UB/LB
as t
AVWL
, t
AVEL
and t
AVBL
respectively, and is
determined by the latter occurring edge.
transitions
for
The Write cycle can be terminated by the earlier
rising edge of E, W or UB/LB.
If the Output is enabled (E = Low, G = Low, LB or
UB = Low), then W will return the outputs to high
impedance within t
WLQZ
of its falling edge. Care
must be taken to avoid bus contention in this type
of operation. Data input must be valid for t
DVWH
before the rising edge of Write Enable, or for t
DVEH
before the rising edge of E, or for t
DVBH
before the
rising edge of UB/LB whichever occurs first, and
remain valid for t
WHDX
, t
EHDX
and t
BHDX
respec-
tively.
Figure 11. Write Enable Controlled, Write AC Waveforms
AI03958
tAVAV
tWHAX
tDVWH
DATA INPUT
A0-A17
E
W
DQ0-DQ15
VALID
tAVWH
tWLWH
tAVWL
tWLQZ
tWHDX
tWHQX
tBLWH
UB, LB
tELWH
DATA
(1)
DATA
(1)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M68AW256ML70ZB1 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:4 Mbit (256K x16) 3.0V Asynchronous SRAM
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M68AW256ML70ZB1F 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:4 Mbit (256K x16) 3.0V Asynchronous SRAM
M68AW256ML70ZB1T 制造商:STMicroelectronics 功能描述:
M68AW256ML70ZB6 功能描述:IC SRAM 4MBIT 70NS 48TFBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)