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參數(shù)資料
| 型號： | M36L0R7050L1 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| 中文描述： | 128兆位（復(fù)用的I / O，多銀行，多層次，多突發(fā)）快閃記憶體，32或64兆移動存儲芯片，1.8V電源多芯片封裝 |
| 文件頁數(shù)： | 20/22頁 |
| 文件大?。?/td> | 118K |
| 代理商： | M36L0R7050L1 |
Part numbering
M36L0R7060U1, M36L0R7060L1, M36L0R7050U1, M36L0R7050L1
20/22
7
Part numbering
Table 7.
Example:
Note:
Devices are shipped from the factory with the memory content bits, in valid blocks, erased to
’1’. For further information on any aspect of this device, please contact your nearest ST
Sales Office.
Part numbering scheme
M36 L 0 R 7 0 5
0 L 1 ZAM F
Device Type
M36 = Multi-Chip Package (Flash + RAM)
Flash 1 Architecture
L = Multi-Level, Multiple Bank, Burst Mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
DDF
=
V
DDP
=
V
DDQF
=
1.7V to 1.95V
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
5 = 32 Mbit
6 = 64 Mbit
RAM 2 Density
0 = No Die
Parameter Block Location
U = Top Boot Block Flash
L = Bottom Boot Block Flash
Product Version
1 = 0.13μm Flash technology and multilevel design, 85ns speeds;
RAM, 70ns speed Mux I/O
Package
ZAM = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Packing Option
E = ECOPACK Package, Standard Packing
F = ECOPACK Package, Tape & Reel Packing
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| M36L0R7050L1ZAME | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050L1ZAMF | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050U1 | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050U1ZAME | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050U1ZAMF | 128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M36L0R7050L1ZAME | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050L1ZAMF | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package |
| M36L0R7050L3ZSE | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays 制造商:Micron Technology Inc 功能描述:IC FLASH PSRAM 160M |
| M36L0R7050L3ZSF | 制造商:Micron Technology Inc 功能描述:WIRELESS - Tape and Reel |
| M36L0R7050L3ZSF TR | 制造商:Micron Technology Inc 功能描述:IC FLASH PSRAM 160M |
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