參數(shù)資料
型號: M34C02-W-LMB1G
廠商: 意法半導(dǎo)體
英文描述: 2 Kbit Serial IC Bus EEPROM for DIMM serial presence detect
中文描述: 2千位串行IC總線的EEPROM內(nèi)存串行存在檢測
文件頁數(shù): 30/31頁
文件大?。?/td> 162K
代理商: M34C02-W-LMB1G
Revision history
M34C02-W, M34C02-L, M34C02-R
30/31
10
Revision history
Table 18.
Document revision history
Date
Revision
Description of Revision
27-Dec-1999
2.0
Adjustments to the formatting. 0 to 70°C temperature range removed from
DC and AC tables.
No change to description of device, or parameters
07-Dec-2000
2.1
New definition of lead soldering temperature absolute rating for certain
packages
13-Mar-2001
2.2
-R voltage range added
18-Jul-2002
2.3
TSSOP8 (3x3mm2 body size) package (MSOP8) added
22-May-2002
2.4
VFDFPN8 package (MLP8) added
21-Jul-2003
3.0
Document reformatted. -F voltage range added.
17-Mar-2004
4.0
Table of Contents added. MLP package changed. Absolute Maximum
Ratings for V
IO
(min) and V
CC
(min) changed. Soldering temperature
information clarified for RoHS compliant devices. Device grade information
clarified
14-Apr-2004
5.0
Typos corrected in Ordering Information example
26-Aug-2004
6.0
Device Grade clarified. Product List summary table added
30-Nov-2004
7.0
SO8 package removed.
14-Oct-2005
8.0
M34C02-R operating frequency upgraded to 400 kHz. Modified
Section 1.1: Device Internal Reset
,
Figure 4: Maximum RP value versus
bus parasitic capacitance (C) for an I2C Bus
,
Table 10: Input Parameters
,
I
CC1
values in
Table 11: DC Characteristics (M34C02-W)
,
Table 13: DC
Characteristics (M34C02-R)
,
Table 15: DC Characteristics (M34C02-W-F)
and moved M34C02-R to
Table 14: AC Characteristics M34C02-W,
M34C02-L, M34C02-R)
. Added
Figure 3: Chip Enable input connection
.
Added EcoPack and Ambient Operating Temperature information.
11-Apr-2006
9
BN and DS (PDIP and TSSOP8) packages removed..
M34C02-F part number removed.
Test Conditions modified for I
CC1
and V
OL
in
Table 11: DC Characteristics
(M34C02-W)
.
Device Internal Reset
removed and replaced by
Section 2.5: Supply
voltage (VCC)
.
Blank option removed below
Plating Technology
in
Table 17
.
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