參數(shù)資料
型號(hào): M34C02-RDW1TG
廠商: 意法半導(dǎo)體
英文描述: 2 Kbit Serial IC Bus EEPROM for DIMM serial presence detect
中文描述: 2千位串行IC總線的EEPROM內(nèi)存串行存在檢測(cè)
文件頁(yè)數(shù): 5/31頁(yè)
文件大?。?/td> 162K
代理商: M34C02-RDW1TG
M34C02-W, M34C02-L, M34C02-R
List of figures
5/31
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TSSOP and MLP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Chip Enable input connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum R
P
value versus bus parasitic capacitance (C) for an I2C Bus . . . . . . . . . . . . . . 9
I
2
C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Setting the Write Protection Register (WC = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Result of setting the write protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write mode sequences in a non write-protected area . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read mode sequences. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Serial presence detect block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC Measurement I/O Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead
2x3mm2, Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
TSSOP8 – 8 lead Thin Shrink Small Outline, package outline. . . . . . . . . . . . . . . . . . . . . . 28
Figure 15.
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