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| 型號(hào)： | M306NLFHGP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 16-BIT, FLASH, 24 MHz, MICROCONTROLLER, PQFP100 |
| 封裝： | 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 |
| 文件頁(yè)數(shù)： | 65/70頁(yè) |
| 文件大?。?/td> | 535K |
| 代理商： | M306NLFHGP |
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REVISION HISTORY
M16C/6N Group (M16C/6NL, M16C/6NN) Data Sheet
Rev.
Date
Description
Page
Summary
A-1
1.00 Jul. 20, 2004
1.01 Nov. 01, 2004
1.02 Jul. 01, 2005
2.10 Aug.25, 2006
–
First edition issued
–
Revised edition issued
* Revised parts and revised contents are as follows (except for expressional change).
26
Table 5.2 Recommended Operating Conditions (1)
IOH(peak): Unit is revised from “V” to “mA”.
27
Table 5.3 Recommended Operating Conditions (2)
NOTE 3: “VCC = 3.0 ± 0.3 V” is revised to “VCC = 3.3 ± 0.3 V”.
28
Table 5.4 IIH, IIL: “P3_3” is revised to “P3_7” in Parameter.
31
Table 5.9: VCC = 3.0 ± 0.3 V” is revised to “VCC = 3.3 ± 0.3 V” in Flash Program, Erase
Voltage.
–
Revised edition issued
* Revised parts and revised contents are as follows (except for expressional change).
5
Table 1.3 Product List is revised.
13
FIgure 4.1 SFR Information (1): The value of After Reset in CM2 Register is revised.
19
Figure 4.7 SFR Information (7): NOTE 1 is revised.
28
Table 5.4 Electrical Characteristics (1)
Measuring Condition of VOL is revised from “LOL = –200A” to “LOL = 200A”.
29
Table 5.5 Electrical Characteristics (2): Mask ROM (5th item)
“f(XCIN)” is changed to “(f(BCLK)).
30
Table 5.6 A/D Conversion Characteristics: “Tolerance Level Impedance” is deleted.
–
Revised edition issued
* Memory expansion and microprocessor modes are added.
* Revised parts and revised contents are as follows (except for expressional change).
2
Table 1.1 Fuictions and Specifications for M16C/6N Group (100-pin version)
Operating Mode is revised.
3
Table 1.2 Fuictions and Specifications for M16C/6N Group (128-pin version)
Operating Mode is revised.
5
Table 1.3 Product Information
Status of development is revised and NOTES 1 and 2 are added.
6
Figure 1.3 Pin Assignments (1): Bus control pins are added.
7, 8
Tables 1.4 and 1.5 List of Pin Names for 100-pin package (1)(2) are added.
9
Figure 1.4 Pin Assignments (2): Bus control pins are added.
10 to 12
Tables 1.6 to 1.8 List of Pin Names for 128-pin package (1)(2)(3) are added.
13 to 15
Tables 1.9 to 1.11 Pin Functions (1)(2)(3) are revised.
18
3. Memory: Last sentence (In memory expansion ...) is added.
Figure 3.1 Memory Map: NOTES 1 and 2 are added.
19
Table 4.1 SFR Information (1)
Value of After Reset in PM0 is revised.
CSR Register is added to 0008h.
CSE Register is added to 001Bh.
NOTE 1 is added.
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相關(guān)代理商/技術(shù)參數(shù) |
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| M306NLFHGP#D3 | 功能描述:IC M16C MCU FLASH 384K 100LQFP RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6NL 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤(pán) 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| M306NLFHGP#U3 | 功能描述:IC M16C MCU FLASH 384K 100LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6NL 標(biāo)準(zhǔn)包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C，SPI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):11 程序存儲(chǔ)器容量:3.5KB（2K x 14） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 包裝:管件 |
| M306NLFJGP | 制造商:Renesas Electronics Corporation 功能描述: |
| M306NLFJGP#U3 | 功能描述:IC M16C/6NL MCU FLASH 100LQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:M16C™ M16C/60/6NL 標(biāo)準(zhǔn)包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C，SPI 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):11 程序存儲(chǔ)器容量:3.5KB（2K x 14） 程序存儲(chǔ)器類(lèi)型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 包裝:管件 |
| M306NLME-XXXGP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:Renesas MCU |
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