
IGLOOe Low Power Flash FPGAs
Revision 13
2-11
Power Consumption of Various Internal Resources
Table 2-15 Different Components Contributing to the Dynamic Power Consumption in IGLOOe Devices
For IGLOOe V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Parameter
Definition
Device-Specific Dynamic
Contributions (W/MHz)
AGLE600
AGLE3000
PAC1
Clock contribution of a Global Rib
19.7
12.77
PAC2
Clock contribution of a Global Spine
4.16
1.85
PAC3
Clock contribution of a VersaTile row
0.88
PAC4
Clock contribution of a VersaTile used as a sequential module
0.11
PAC5
First contribution of a VersaTile used as a sequential module
0.057
PAC6
Second contribution of a VersaTile used as a sequential module
0.207
PAC7
Contribution of a VersaTile used as a combinatorial module
0.207
PAC8
Average contribution of a routing net
0.7
PAC9
Contribution of an I/O input pin (standard-dependent)
PAC10
Contribution of an I/O output pin (standard-dependent)
PAC11
Average contribution of a RAM block during a read operation
25.00
PAC12
Average contribution of a RAM block during a write operation
30.00
PAC13
Dynamic contribution for PLL
2.70
Note: For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power
calculator or SmartPower in Libero SoC software.
Table 2-16 Different Components Contributing to the Static Power Consumption in IGLOO Devices
For IGLOOe V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Parameter
Definition
Device Specific Static Power (mW)
AGLE600
AGLE3000
PDC1
Array static power in Active mode
PDC2
Array static power in Static (Idle) mode
PDC3
Array static power in Flash*Freeze mode
PDC4
Static PLL contribution
1.84
PDC5
Bank quiescent power (VCCI-dependent)
PDC6
I/O input pin static power (standard-dependent)
PDC7
I/O output pin static power (standard-dependent)