5-10 Revision 4 Advance 1.0 (continued) In Table 2-47 ADC Characteristics in Direct" />
參數(shù)資料
型號(hào): M1AFS600-FGG484I
廠商: Microsemi SoC
文件頁(yè)數(shù): 253/334頁(yè)
文件大?。?/td> 0K
描述: IC FPGA 4MB FLASH 600K 484-FBGA
標(biāo)準(zhǔn)包裝: 60
系列: Fusion®
RAM 位總計(jì): 110592
輸入/輸出數(shù): 172
門(mén)數(shù): 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
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Datasheet Information
5-10
Revision 4
Advance 1.0
(continued)
In Table 2-47 ADC Characteristics in Direct Input Mode, the commercial conditions
were updated and note 2 is new.
2-121
The VCC33ACAP signal name was changed to "XTAL1 Crystal Oscillator Circuit
Input".
2-228
Table 2-48 Uncalibrated Analog Channel Accuracy* is new.
2-123
Table 2-49 Calibrated Analog Channel Accuracy 1,2,3 is new.
2-124
Table 2-50 Analog Channel Accuracy: Monitoring Standard Positive Voltages is
new.
2-125
In Table 2-57 Voltage Polarity Control Truth Table—AV (x = 0), AC (x = 1), and AT
(x = 3)*, the following I/O Bank names were changed:
Hot-Swap changed to Standard
LVDS changed to Advanced
2-131
In Table 2-58 Prescaler Op Amp Power-Down Truth Table—AV (x = 0), AC (x = 1),
and AT (x = 3), the following I/O Bank names were changed:
Hot-Swap changed to Standard
LVDS changed to Advanced
2-132
In the title of Table 2-64 I/O Standards Supported by Bank Type, LVDS I/O was
changed to Advanced I/O.
2-134
The title was changed from "Fusion Standard, LVDS, and Standard plus Hot-Swap
I/O" to Table 2-68 Fusion Standard and Advanced I/O Features. In addition, the
table headings were all updated. The heading used to be Standard and LVDS I/O
and was changed to Advanced I/O. Standard Hot-Swap was changed to just
Standard.
2-136
This sentence was deleted from the "Slew Rate Control and Drive Strength" section:
The Standard hot-swap I/Os do not support slew rate control. In addition, these
references were changed:
From: Fusion hot-swap I/O (Table 2-69 on page 2-122) To: Fusion Standard I/O
From: Fusion LVDS I/O (Table 2-70 on page 2-122) To: Fusion Advanced I/O
2-152
The "Cold-Sparing Support" section was significantly updated.
2-143
In the title of Table 2-75 Fusion Standard I/O Standards—OUT_DRIVE Settings,
Hot-Swap was changed to Standard.
2-153
In the title of Table 2-76 Fusion Advanced I/O Standards—SLEW and OUT_DRIVE
Settings, LVDS was changed to Advanced.
2-153
In the title of Table 2-81 Fusion Standard and Advanced I/O Attributes vs. I/O
Standard Applications, LVDS was changed to Advanced.
2-157
In Figure 2-111 Naming Conventions of Fusion Devices with Three Digital I/O
Banks and Figure 2-112 Naming Conventions of Fusion Devices with Four I/O
Banks the following names were changed:
Hot-Swap changed to Standard
LVDS changed to Advanced
2-160
The Figure 2-113 Timing Model was updated.
2-161
In the notes for Table 2-86 Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial and Industrial Conditions, TJ was changed to TA.
2-166
Revision
Changes
Page
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M1AFS600-FGG484K 功能描述:IC FPGA 4MB FLASH 600K 484-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Fusion® 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA(23x23)
M1AFS600-FGG484XZ 制造商:Microsemi Corporation 功能描述:
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