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參數(shù)資料
| 型號(hào)： | M1A3PE3000-2FG324I |
| 廠商： | Microsemi SoC |
| 文件頁(yè)數(shù)： | 24/162頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 3M 324-FBGA |
| 標(biāo)準(zhǔn)包裝： | 84 |
| 系列： | ProASIC3E |
| RAM 位總計(jì)： | 516096 |
| 輸入/輸出數(shù)： | 221 |
| 門(mén)數(shù)： | 3000000 |
| 電源電壓： | 1.425 V ~ 1.575 V |
| 安裝類(lèi)型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 324-BGA |
| 供應(yīng)商設(shè)備封裝： | 324-FBGA（19x19） |
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ProASIC3E Device Family Overview
1-6
Revision 13
Pro I/Os with Advanced I/O Standards
The ProASIC3E family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.5 V,
1.8 V, 2.5 V, and 3.3 V). ProASIC3E FPGAs support 19 different I/O standards, including single-ended,
differential, and voltage-referenced. The I/Os are organized into banks, with eight banks per device (two
per side). The configuration of these banks determines the I/O standards supported. Each I/O bank is
subdivided into VREF minibanks, which are used by voltage-referenced I/Os. VREF minibanks contain 8
to 18 I/Os. All the I/Os in a given minibank share a common VREF line. Therefore, if any I/O in a given
VREF minibank is configured as a VREF pin, the remaining I/Os in that minibank will be able to use that
reference voltage.
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following:
Single-Data-Rate applications (e.g., PCI 66 MHz, bidirectional SSTL 2 and 3, Class I and II)
Double-Data-Rate applications (e.g., DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point
communications, and DDR 200 MHz SRAM using bidirectional HSTL Class II)
ProASIC3E banks support M-LVDS with 20 multi-drop points.
Hot-swap (also called hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of a card
in a powered-up system.
Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data undisturbed
when the system is powered up, while the component itself is powered down, or when power supplies
are floating.
Specifying I/O States During Programming
You can modify the I/O states during programming in FlashPro. In FlashPro, this feature is supported for
PDB files generated from Designer v8.5 or greater. See the FlashPro User’s Guide for more information.
Note: PDB files generated from Designer v8.1 to Designer v8.4 (including all service packs) have
limited display of Pin Numbers only.
1. Load a PDB from the FlashPro GUI. You must have a PDB loaded to modify the I/O states during
programming.
2. From the FlashPro GUI, click PDB Configuration. A FlashPoint – Programming File Generator
window appears.
3. Click the Specify I/O States During Programming button to display the Specify I/O States During
Programming dialog box.
4. Sort the pins as desired by clicking any of the column headers to sort the entries by that header.
Select the I/Os you wish to modify (Figure 1-3 on page 1-7).
5. Set the I/O Output State. You can set Basic I/O settings if you want to use the default I/O settings
for your pins, or use Custom I/O settings to customize the settings for each pin. Basic I/O state
settings:
1 – I/O is set to drive out logic High
0 – I/O is set to drive out logic Low
Last Known State – I/O is set to the last value that was driven out prior to entering the
programming mode, and then held at that value during programming
Z -Tri-State: I/O is tristated
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| ACB90DHNN | CONN EDGECARD 180PS .050 DIP SLD |
| ABB90DHNN | CONN EDGECARD 180PS .050 DIP SLD |
| ACB90DHND | CONN EDGECARD 180PS .050 DIP SLD |
| A3PE3000-2FGG324I | IC FPGA 1KB FLASH 3M 324-FBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M1A3PE3000-2FG484 | 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| M1A3PE3000-2FG484I | 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門(mén)數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類(lèi)型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75） |
| M1A3PE3000-2FG896 | 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3E 產(chǎn)品培訓(xùn)模塊:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色產(chǎn)品:Cyclone? IV FPGAs 標(biāo)準(zhǔn)包裝:60 系列:CYCLONE® IV GX LAB/CLB數(shù):9360 邏輯元件/單元數(shù):149760 RAM 位總計(jì):6635520 輸入/輸出數(shù):270 門(mén)數(shù):- 電源電壓:1.16 V ~ 1.24 V 安裝類(lèi)型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FBGA（23x23） |
| M1A3PE3000-2FG896ES | 制造商:ACTEL 制造商全稱(chēng):Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs |
| M1A3PE3000-2FG896I | 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:ProASIC3E 標(biāo)準(zhǔn)包裝:1 系列:ProASICPLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計(jì):129024 輸入/輸出數(shù):248 門(mén)數(shù):600000 電源電壓:2.3 V ~ 2.7 V 安裝類(lèi)型:表面貼裝 工作溫度:- 封裝/外殼:352-BFCQFP，帶拉桿 供應(yīng)商設(shè)備封裝:352-CQFP（75x75） |
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