ARM CortexTM-M1 6P ro d u c t B r " />
參數資料
型號: M1A3P600L-FG256
廠商: Microsemi SoC
文件頁數: 9/12頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
標準包裝: 90
系列: ProASIC3L
RAM 位總計: 110592
輸入/輸出數: 177
門數: 600000
電源電壓: 1.14V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應商設備封裝: 256-FPBGA(17x17)
ARM CortexTM-M1
6P ro d u c t B r i e f
stack. You can access the APSR with the MSR and
MRS instructions.
Interrupt PSR (IPSR) – Contains the Interrupt
Service Routine (ISR) number of the current
exception activation.
Execution PSR (EPSR) – Contains the Thumb state
bit (T-bit). Unless the processor is in Debug state,
the EPSR is not directly accessible. All fields read as
zero using an MRS instruction and MSR instruction
writes are ignored.
On entering an exception, the processor saves the
combined information from the three status registers on
the stack.
Special Purpose Priority Mask Register
Use the special purpose Priority Mask Register for
priority boosting. You can access the special purpose
Priority
Mask
Register
using
the
MSR
and
MRS
instructions. You can also use the CPS instruction to set or
clear PRIMASK.
Special Purpose Control Register
The special purpose Control Register identifies the stack
pointers used.
Data Types
The processor supports the following data types:
32-bit words
16-bit halfwords
8-bit bytes
Note: Unless otherwise stated, the core can access all
regions of the memory map, including the code region,
with all data types. To support this, the system must
support sub-word writes without corrupting neighboring
bytes in that word.
Memory Formats
The processor views memory as a linear collection of
bytes numbered in ascending order from 0 (Figure 3).
Figure 3 Processor Memory Map
0xE00FFFFF
0xF00FF000
0xE000ED00
0xE000E000
0xE0003000
0xE0002000
0xE0001000
0xE0000000
0xE000F000
0xE003FFFF
0xE0040000
0xE0041000
0xE0042000
ROM Table
Reserved
BP
DW
Reserved
NVIC
Debug Control
Reserved
0x3FFFFFFF
0x20100000
511 MB
1 MB
511 MB
1 MB
External
DTCM
External
ITCM
0x00100000
0x1FFFFFFF
0x20000000
0x00000000
Reserved
Internal Private Peripheral Bus
1 GB
0.5 GB
Code
SRAM
Peripheral
External
External Device
0.5 GB
0xFFFFFFFF
0xE0100000
0x5FFFFFFF
0x40000000
0x3FFFFFFF
0x20000000
0x1FFFFFFF
0x00000000
0x60000000
0x9FFFFFFF
0xA0000000
0xDFFFFFFF
0x00000000
相關PDF資料
PDF描述
RSA50DRMD-S288 CONN EDGECARD 100POS .125 EXTEND
A3P250-VQ100T IC FPGA 1KB FLASH 250K 100-VQFP
A3P250-VQG100T IC FPGA 1KB FLASH 250K 100-VQFP
RMA50DRMD-S288 CONN EDGECARD 100POS .125 EXTEND
EPF6016BC256-2 IC FLEX 6000 FPGA 16K 256-BGA
相關代理商/技術參數
參數描述
M1A3P600L-FG256I 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3L 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
M1A3P600L-FG484 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3L 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
M1A3P600L-FG484I 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3L 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
M1A3P600L-FGG144 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3L 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
M1A3P600L-FGG144I 功能描述:IC FPGA 1KB FLASH 600K 144-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3L 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)