ARM CortexTM-M1 Prod uct Br ief 11 " />
參數(shù)資料
型號: M1A3P600-2FGG484I
廠商: Microsemi SoC
文件頁數(shù): 3/12頁
文件大?。?/td> 0K
描述: IC FPGA 1KB FLASH 600K 484-FBGA
標準包裝: 40
系列: ProASIC3
RAM 位總計: 110592
輸入/輸出數(shù): 235
門數(shù): 600000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 484-BGA
供應(yīng)商設(shè)備封裝: 484-FPBGA(23x23)
ARM CortexTM-M1
Prod uct Br ief
11
Datasheet Categories
In order to provide the latest information to designers, some datasheets are published before data has been fully
characterized. Datasheets are designated as "Product Brief," "Advanced," and "Production." The definitions of these
categories are as follows:
Product Brief
The product brief is a summarized version of an advanced or production datasheet containing general product
information. This brief summarizes specific device and family information for unreleased products.
Advanced
This datasheet version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production.
Unmarked (production)
This datasheet version contains information that is considered to be final.
相關(guān)PDF資料
PDF描述
M1A3P600-2FG484I IC FPGA 1KB FLASH 600K 484-FBGA
ACB106DHRQ-S621 CONN EDGECARD EXTEND 212POS .050
ABB106DHRQ-S621 CONN EDGECARD EXTEND 212POS .050
A3P600-2FGG484I IC FPGA 1KB FLASH 600K 484-FBGA
A3P600-2FG484I IC FPGA 1KB FLASH 600K 484-FBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
M1A3P600-2PQ144 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-2PQ144ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-2PQ144I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-2PQ144PP 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
M1A3P600-2PQ208 功能描述:IC FPGA 1KB FLASH 600K 208-PQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ProASIC3 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應(yīng)商設(shè)備封裝:256-FPBGA(17x17)