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參數(shù)資料
| 型號： | LX8816 |
| 廠商： | Microsemi Corporation |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| 中文描述： | 無電容，NMOS管，150mA的低壓差穩(wěn)壓器的反向電流保護 |
| 文件頁數(shù)： | 7/9頁 |
| 文件大?。?/td> | 375K |
| 代理商： | LX8816 |
Microsemi
Integrated Products
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
Copyright
2000
Rev. 1.2a, 2002-11-01
W
M
.
C
LX8816
Dual Channel 1A Low Dropout Regulator
P
RODUCTION
D
ATA
S
HEET
I N T E G R A T E D P R O D U C T S
A P P L I C A T I O N I N F O R M A T I O N
Layout Consideration
The layout must be done with low impedance paths for V
IN
, V
1,
V
2
and
Ground by using sufficiently wide traces to avoid voltage drops and
noise pick up. The output capacitors must be placed as close as
possible to the voltage regulator output pins. To allow the same
voltage reference for all circuits, use a star configuration from the
output capacitors to the different loads. The input capacitor should be
connected between V
IN
and ground with short leads. Although it may
not be immediately obvious, best load regulation for the adjustable
output is obtained when the top of the resistor divider, (
R
1), is
connected
as close as possible
to the case of the regulator,
not to the
load
.
Heatsink Consideration
The PCB copper can be used as a heatsink for the surface mounted
S-Pak. Using the minimum size as shown in the recommended pad
layout limits the usable power to about 1W for ambient temperature of
50°C. Since most applications require greater than 2W there is the
need to provide additional heat sinking. This can be accomplished by
using additional copper area both on the PCB surface as shown in the
possible heat sink layout below, or to an embedded ground plane.
Since the die pad (copper tab) is in electrical contact with ground, the
designer can use thermal vias on the surface of the PCB taking
advantage of the heat-spreading (Cu) layer of an internal ground plane.
H E A T S I N K L A Y O U T
Board Level
Ground
Plane
Component
Trace
B
A
Component
Component Trace
Ground Plane
Inner Power Plane
Backside Trace
VIAS
B
A
Figure 3
- Heatsink
R E C O M M E N D E D M I N I M U M P C B F O O T P R I N T
11.56mm
9.98mm
8.84mm
3.28mm
.86mm
1.83mm
4.39mm
5.36mm
7.92mm
8.89mm
9.75mm
0mm
1.37mm
A
P
P
L
I
C
A
T
I
O
N
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相關代理商/技術參數(shù) |
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| LX8816-03CDF | 制造商:Microsemi Corporation 功能描述:PLASTIC MLP AND 3 PIN PLASTIC TO-252 PACKAGES - Bulk |
| LX8816-04CDF | 功能描述:IC REG LDO 3.3V/ADJ SPAK-5 RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標準包裝:3,000 系列:- 穩(wěn)壓器拓撲結構:正，固定式和可調(diào)式 輸出電壓:3.3V，1.25 V ~ 5.7 V 輸入電壓:4.5 V ~ 7 V 電壓 - 壓降（標準）:1.1V @ 1A 穩(wěn)壓器數(shù)量:2 電流 - 輸出:1A 電流 - 限制（最?。?1A 工作溫度:0°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-252-5，DPak（4 引線 + 接片），TO-252AD 供應商設備封裝:PPAK 包裝:管件 其它名稱:497-3576-5 |
| LX8816-04CDF-TR | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:Dual Channel 1A Low Dropout Regulator |
| LX8817 | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:Dual Channel 2.5A Low Dropout Regulator |
| LX8817-2500CDF | 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:Dual Channel 2.5A Low Dropout Regulator |
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