參數(shù)資料
型號(hào): LX8221
廠商: Microsemi Corporation
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
中文描述: 無(wú)電容,NMOS管,150mA的低壓差穩(wěn)壓器的反向電流保護(hù)
文件頁(yè)數(shù): 5/9頁(yè)
文件大?。?/td> 218K
代理商: LX8221
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
Copyright
2000
Rev. 1.0a, 2005-03-03
W
M
.
C
LX8221
Dual 150mA CMOS Low Dropout Regulator
P
RODUCTION
D
ATA
S
HEET
TM
tantalum or electrolytic capacitor with a minimum
recommended capacitance value of 1.0
μ
F and ESR
between 5m
and 1
will satisfy the stability for the entire
operating range.
Optional Bypass Capacitor
The fixed/adjustable voltage version of the LX8221
includes a separate Bypass pin (CB1) for the fixed
regulator that allows for further reduction of output noise.
If the regulator’s output noise performance meets system
design specifications without the capacitor, omit it. The
bypass capacitor impacts the start up time, which is
inversely proportional to the size of bypass capacitor.
Further, the bypass capacitor reduces the regulator phase
margin. Hence, implementing the bypass capacitor will
require the use of a larger output capacitor to maintain the
its output current.
Thermal Consideration
Thermal shutdown protects the integrated circuit from
thermal overload caused from a rise in junction temperature
during power dissipation. This type of protection is intended
for fault protection only and not as a means of current (or,
power) limiting during normal application usage. Proper
thermal evaluation should be done to ensure that the junction
temperature dose not exceed it’s maximum rating. Operating
at the maximum T
J
of 150°C can impact reliability. Due to
variation in individual device electrical characteristics and
thermal resistance, the built in thermal overload protection
may be activated at power levels slightly above or below the
rated dissipation. Power dissipation for each regulator can
A P P L I C A T I O N S
be calculated using the following equation:
(
(
IN
D
V
P
=
(Note: power dissipation resulting from quiescent current
is negligible)
For the MSOP package, thermal resistance,
θ
JA
is 220
0
C/W
when mounted on a FR4 copper clad PCB. Junction
temperature of the integrated circuit can be calculated
using:
T
T
=
Where:
(
RISE
P
T
=
Example
: Given the following conditions:
T
A
= 60°C
V
IN
= 4.2V
V
OUT
= 2.7V
I
OUT
= 100mA
)
)
(
)
(
)
MAX
OUT
MIN
OUT
MAX
I
V
×
RISE
T
A
J
+
)
JA
D
Θ
×
calculate the
total power dissipation
and
junction
temperature:
Total Power Dissipation:
(
V
7
V
2
P
D
=
Junction Temperature:
(
W
C
T
J
15
.
60
×
+
=
Layout Consideration:
The layout must be implemented with low impedance paths
for V
IN
, V
OUT
and Ground by creating sufficiently wide
traces to avoid voltage drops and pick up noise. Adding an
area of PCB copper to the GND pin (pin 8) will reduce the
overall
θ
JA
since it is thermally connected to the device
substrate. This will lower the device junction temperature
improving overall output voltage accuracy. The input/output
capacitors must be placed as close as possible to each
voltage regulator output pin.
)
W
15
.
A
1
×
=
)
C
W
C
o
o
o
93
/
220
=
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