參數(shù)資料
型號(hào): LX8221-BIDU
英文描述: Analog IC
中文描述: 模擬IC
文件頁(yè)數(shù): 5/9頁(yè)
文件大?。?/td> 211K
代理商: LX8221-BIDU
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 5
Copyright
2000
Rev. 1.0, 2002-01-02
W
M
.
C
LX8221
Dual 150mA CMOS Low Dropout Regulator
P
RODUCTION
A P P L I C A T I O N S
be calculated using the following equation:
(
(
IN
D
V
P
=
(Note: power dissipation resulting from quiescent current
is negligible)
For the MSOP package, thermal resistance,
θ
JA
is 220
0
C/W
when mounted on a FR4 copper clad PCB. Junction
temperature of the integrated circuit can be calculated
using:
T
T
=
Where:
(
RISE
P
T
=
Example
: Given the following conditions:
!
T
A
= 60°C
!
V
IN
= 4.2V
!
V
OUT
= 2.7V
!
I
OUT
= 100mA
)
)
(
)
(
)
MAX
OUT
MIN
OUT
V
MAX
I
×
RISE
T
A
J
+
)
JA
D
Θ
×
calculate the
total power dissipation
and
junction
temperature:
Total Power Dissipation:
(
V
7
V
2
P
D
=
Junction Temperature:
(
W
C
T
J
15
.
60
×
+
=
Layout Consideration:
The layout must be implemented with low impedance paths
for V
IN
, V
OUT
and Ground by creating sufficiently wide
traces to avoid voltage drops and pick up noise. Adding an
area of PCB copper to the GND pin (pin 8) will reduce the
overall
θ
JA
since it is thermally connected to the device
substrate. This will lower the device junction temperature
improving overall output voltage accuracy. The input/output
capacitors must be placed as close as possible to each
voltage regulator output pin.
)
W
15
.
A
1
×
=
)
C
W
C
o
o
o
93
/
220
=
A
P
P
L
I
C
A
T
I
O
N
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