參數(shù)資料
型號: LX8117-XX
廠商: Microsemi Corporation
英文描述: 0.8, 1 & 1.2A LOW DROPOUT POSITIVE REGULATORS
中文描述: 0.8,1
文件頁數(shù): 2/9頁
文件大?。?/td> 222K
代理商: LX8117-XX
0.8, 1 & 1.2A L
OW
D
ROPOUT
P
OSITIVE
R
EGULATORS
LX8117-xx/8117A-xx/8117B-xx
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1999
Rev. 1.4 3/99
2
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Power Dissipation .................................................................................. Internally Limited
Input Voltage
LX8117-00/8117A-00/8117B-00 (Adj.) ..................................................................... 15V
LX8117-33/8117A-33/8117B-33 (3.3V), LX8117-05/8117A-05/8117B-05 (5.0V).... 15V
LX8117-25/8117A-25/8117B-25 (2.5V), LX8117-28/8117A-28/8117B-28 (2.85V).. 12V
Surge Voltage ............................................................................................................... 15V
Operating Junction Temperature
Plastic (ST, DD & DT Packages) .......................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Short-Circuit Protection....................................................................................... Indefinite
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified terminal.
PACKAGE PIN OUTS
3.
IN
2.
OUT
1.
ADJ / GND
ST PACKAGE
(Top View)
3
2
1
DD PACKAGE (D
2
Pak)
(Top View)
THERMAL DATA
TAB IS V
OUT
ST PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θ
JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DD PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θ
JT
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DT PACKAGE:
THERMAL RESISTANCE-JUNCTION TO TAB,
θ
JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Junction Temperature Calculation: T
= T
+ (P
x
θ
). The
θ
numbers are guidelines for the
thermal performance of the device/pc-board system. All of the above assume no ambient airflow.
*
θ
can be improved with package soldered to 0.5IN
2
copper area over backside ground
plane or internal power plane.
θ
can vary from 20oC/W to > 40oC/W depending on
mounting technique. (See Application Notes Section: Thermal Considerations)
15°C/W
*150°C/W
10°C/W
*60°C/W
9°C/W
*80°C/W
TAB IS V
OUT
BLOCK DIAGRAM
Thermal
Limit Circuit
Control
Circuit
Bandgap
Circuit
Output
Circuit
Bias
Circuit
V
OUT
V
IN
Current
Limit Circuit
ADJ
3.
IN
2.
OUT
1.
ADJ / GND
DT PACKAGE (D-Pak)
(Top View)
TAB IS V
OUT
IN
OUT
ADJ / GND
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