參數(shù)資料
型號: LX7001MY
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類: 電源管理
英文描述: TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP8
封裝: CERAMIC, DIP-8
文件頁數(shù): 2/9頁
文件大小: 137K
代理商: LX7001MY
T
RANSIENT
I
MMUNE
U
NDERVOLTAGE
S
ENSING
C
IRCUIT
LX 7001
PRODUCT DATABOOK 1 9 9 6 / 1 9 9 7
Copyright 1999
Rev. 1.2 6/99
2
P
R O D U C T I O N
D
A T A
S
H E E T
A B S O L U T E M A X I M U M R A T I N G S
(Note 1)
Input Supply Voltage (V
IN
) ............................................................................... -1V to 12V
RESET Output Voltage (V
) .......................................................................... -1V to 12V
Output Sink Current (I
) ............................................................Internally Limited (mA)
Clamp Diode Forward Current (I
F
), Pin 1 to pin 2............................................... 100mA
Operating Junction Temperature
Ceramic (Y - Package) .......................................................................................... 150°C
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
P A C K A G E P I N O U T S
RESET
V
IN
N.C.
GROUND
N.C.
N.C.
N.C.
N.C.
1
8
2
7
3
6
4
5
DM PACKAGE
(Top View)
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Y PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
165°C/W
156°C/W
130°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
T H E R M A L D A TA
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
3.
GROUND
2.
V
IN
1.
RESET
LP PACKAGE
(Top View)
Y PACKAGE
(Top View)
RESET
V
IN
N.C.
GROUND
N.C.
N.C.
N.C.
N.C.
1
8
2
7
3
6
4
5
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