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參數(shù)資料
| 型號(hào)： | LX5226CDWPT |
| 廠商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分類： | 通用總線功能 |
| 英文描述： | Terminator |
| 中文描述： | 18-LINE 110 ohm SCSI BUS TERMINATOR, PDSO28 |
| 封裝： | PLASTIC, SOP-28 |
| 文件頁(yè)數(shù)： | 2/4頁(yè) |
| 文件大?。?/td> | 147K |
| 代理商： | LX5226CDWPT |
U
LT R A
1 8 - L
I N E
S C S I T
E R M I N A T O R
LX5226
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1999
Rev. 1.0 5/99
2
P
R O D U C T I O N
D
A T A
S
H E E T
UltraMAX
Termpwr Voltage
Signal Line Voltage
Disconnect Input Voltage
Operating Virtual Junction Temperature Range
LX5226C
V
TERM
R E C O M M E N D E D O P E R AT I N G C O N D I T I O N S
(Note 2)
Parameter
Symbol
Units
Recommended Operating Conditions
Min.
Typ.
Max.
4.0
0
0
5.5
5
V
TERM
V
V
V
0
125
°C
Note 2. Range over which the device is functional.
ABSOLUTE MAXIMUM RATINGS
(Note 1)
TermPwr Voltage .................................................................................................+7V
Signal Line Voltage ................................................................................... 0V to +7V
Operating Junction Temperature
Plastic (DWP Packages) ............................................................................... 150°C
Storage Temperature Range ..............................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
DWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θ
JL
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
18°C/W
40°C/W
THERMAL DATA
PACKAGE PIN OUTS
DWP PACKAGE
(Top View)
DISC
T1
T2
T3
T4
T5
HEAT SINK/GND
GND
HEAT SINK/GND
T6
T7
T8
T9
V
TERM
GND
T18
T17
T16
T15
T14
HEAT SINK/GND
HEAT SINK/GND
HEAT SINK/GND
T13
T12
T11
T10
N.C.
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
2.65
2.85
10
424
50
-22
V
15
450
150
-24
-10
1
mA
mA
μA
mA
μA
μA
MHz
mA
-20
35
7
ELECTRICAL CHARACTERISTICS
Term Power = 4.75V unless otherwise specified.
Unless otherwise specified, these specifications apply at the recommended operating ambient tempera-
ture of T
A
= 25°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.
Parameter
Symbol
Test Conditions
Units
LX5226
Typ.
Min.
Max.
Output High Voltage
TermPwr Supply Current
V
OUT
I
CC
All data lines = open
All data lines = 0.2V
DISC Pin > 2.0V
V
OUT
= 0.2V
DISC Pin = 0V
DISC Pin = > 2.0V, V
O
= 0.2V
Output Current
Disconnect Input Current
Output Leakage Current
Channel Bandwidth
Termination Sink Current, per Channel
I
OUT
I
IN
I
OL
BW
I
SINK
V
OUT
= 4V
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