參數(shù)資料
型號(hào): LX5212CN
廠商: MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP
元件分類: 通用總線功能
英文描述: 9-LINE LOW CAPACITANCE, レPOWER SCSI TERMINATOR
中文描述: 9-LINE 110 ohm SCSI BUS TERMINATOR, PDIP16
封裝: PLASTIC, DIP-16
文件頁(yè)數(shù): 2/4頁(yè)
文件大小: 150K
代理商: LX5212CN
9-L
INE
L
OW
C
APACITANCE
, μP
OWER
SCSI T
ERMINATOR
LX5212
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 1997
Rev. 1.8 11/97
2
P
R O D U C T I O N
D
A T A
S
H E E T
TermPwr Voltage .................................................................................................+7V
Signal Line Voltage ................................................................................... 0V to +7V
Regulator Output Current ................................................................................... 0.4A
Operating Junction Temperature
Plastic (N, PWP, DP Packages).................................................................... 150°C
Storage Temperature Range ..............................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
N PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
PWP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θ
JL
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO LEADS,
θ
JL
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
65°C/W
27°C/W
100°C/W
20°C/W
50°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
THERMAL DATA
Disconnect
Outputs
Quiescent
Current
600μA
0.5μA
0.5μA
L
H
Enabled
HI Z
HI Z
Open
P
OWER
U
P
/ P
OWER
D
OWN
F
UNCTION
T
ABLE
ABSOLUTE MAXIMUM RATINGS
(Note 1)
PACKAGE PIN OUTS
N PACKAGE
(Top View)
PWP PACKAGE
(Top View)
T6
T5
REG OUT
N.C.
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
N.C.
V
TERM
T4
T3
1
24
2
23
3
22
4
5
21
20
6
19
7
18
8
17
9
10
16
15
11
14
12
13
T7
T8
T9
N.C.
GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
HEATSINK/GND
DISCONNECT
T1
T2
T7
T8
T9
N.C.
GND
DISCONNECT
T1
T2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
T6
T5
REG OUT
N.C.
N.C.
V
TERM
T4
T3
T7
T8
T9
HEATSINK/GND
GND
DISCONNECT
T1
T2
T6
T5
REG OUT
HEATSINK/GND
HEATSINK/GND
V
TERM
T4
T3
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
DP PACKAGE
(Top View)
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