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參數(shù)資料
| 型號： | LX5120CDBT |
| 英文描述： | Terminator |
| 中文描述： | 終結(jié)者 |
| 文件頁數(shù)： | 2/3頁 |
| 文件大?。?/td> | 142K |
| 代理商： | LX5120CDBT |
ULTRA 27-L
INE
, P
LUG
AND
P
LAY
SCSI T
ERMINATOR
LX5120
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
Copyright 2000
Rev. 1.0 4/00
2
P
R O D U C T I O N
D
A T A
S
H E E T
UltraMAX
2.65
2.85
12
635
10
-23
V
20
670
150
-24
-10
1
mA
mA
μA
mA
μA
μA
MHz
mA
-20
35
7
Termination Voltage
High Level Disable Input Voltage
Low Level Disable Input Voltage
Operating Virtual Junction Temperature Range
LX5120C
V
TERM
V
IH
V
IL
R E C O M M E N D E D O P E R AT I N G C O N D I T I O N S
(Note 2)
Parameter
Symbol
Units
Recommended Operating Conditions
Min.
Typ.
Max.
4.0
2
0
5.5
V
TERM
0.8
V
V
V
0
125
°C
Note 2. Range over which the device is functional.
E L E C T R I C A L C H A R A C T E R I S T I C S
Term Power = 4.75V unless otherwise specified.
Unless otherwise specified, these specifications apply at the recommended operating ambient tempera-
ture of T
A
= 25°C. Low duty cycle pulse testing techniques are used which maintains junction and case temperatures equal to the ambient temperature.
Parameter
Symbol
Test Conditions
Units
LX5120
Typ.
Min.
Max.
Output High Voltage
TermPwr Supply Current
V
OUT
I
CC
All data lines = open
All data lines = 0.2V
DIS (Disable) Pin >2.0V
V
OUT
= 0.2V
DIS = 0V
DIS > 2.0V, V
O
= 0.2V
Output Current
Disable Input Current
Output Leakage Current
Channel Bandwidth
Termination Sink Current, per Channel
I
OUT
I
IN
BW
I
SINK
V
OUT
= 4V
A B S O L U T E M A X I M U M R AT I N G S
(Note 1)
TermPwr Voltage .....................................................................................................7V
Continuous Output Voltage Range .............................................................. 0 to 5.5V
Continuous Disable Voltage Range.............................................................. 0 to 5.5V
Operating Junction Temperature
Plastic (DB Package) ..................................................................................... 150oC
Storage Temperature Range ............................................................. -65°C to +150°C
Solder Temperature (Soldering, 10 seconds) ................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device.
PA C K A G E P I N O U T S
DB PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
50°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
T H E R M A L D ATA
DB PACKAGE
(Top View)
T27
T26
T25
T18
T17
T16
T15
N.C.
GND
GND
GND
V
T
T14
T13
T12
T11
T24
T23
T19
T20
T1
T2
T3
T4
T5
GND
GND
GND
DIS
T6
T7
T8
T9
T10
T21
T22
1
36
2
35
3
34
4
33
5
32
6
31
7
30
8
29
9
28
10
27
11
26
12
25
13
24
14
23
15
22
16
21
17
20
18
19
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