
LX1686
2
(Unless otherwise specified, these specifications apply over the recommended operating conditions of T
= 0 to 85°C, VDD=VDD_P= 3.0 to 5.5V)
(Ri = 40k
, C
VCO
= 0.01μF, C
AFD
= 0.22μF, C
TRI
= 0.83μF, C
RAMP
= 208pF, R
RAMP
= 15k
, C
PD
= 0.22μF, C
PDC
= 0.047μF, R
PD
= 110k
.)
Power Supply Voltage
Operating Current
Power Supply Voltage
Output Buffer Operating Current
UVLO Threshold
UVLO Hysteresis
Direct Drive Ramp Block
Triangular Wave Generator Analog Output Peak Voltage
Triangular Wave Generator Analog Output Valley Voltage
Triangular Wave Generator Oscillation Frequency
Triangular Wave Generator Oscillation Charge Current
Triangular Wave Generator Oscillation Discharge Current
Ramp Generator Analog Output Peak Voltage
Ramp Generator Analog Output Valley Voltage
Ramp Frequency Change Threshold
VDD
I
DD
VDD_P
I
DD_P
V
TH_UVLO
V
H_UVLO
VDD = VDD_P
VDD = VDD_P = 5V
VDD = VDD_P
Volsns = VDD = VDD_P = 5V, C
A
= C
B
= 1000pF
Parameter
Symbol
Test Conditions
Units
LX1686
Typ.
Min.
3
Max.
5.5
7
5.5
10
2.9
V
5
mA
V
mA
V
mV
3
2
2.7
160
V
P_TRI
V
V_TRI
F
_TRI
I
CHG_TRI
I
DISCHG_TRI
V
P_RAMP
V
V_RAMP
V
TH_RAMP_R
Tri_c = 0V
Tri_c = 3V
VDD = 3V
VDD = 5.5V
V
TRI_C
= 1.4V
V
TRI_C
= 2.25V
VDD = 3V
VDD = 3V
GBD
Ramp Generator Oscillation Frequency - Nominal
Ramp Generator Oscillation Frequency - Maximum
OLSNS Threshold Voltage
OLSNS Hysteresis
OLSNS-to-ICOMP Propagation Delay
F
RAMP
F
RAMP_HI
V
TH_OLSNS
V
H_OLSNS
T
D_OLSNS
2.25
0.75
10
-2.55
2.65
2.25
0.75
1.5
1.65
100
200
300
45
1
V
V
Hz
μA
μA
V
V
V
V
KHz
KHz
mV
mV
μS
-2.3
2.3
-2.9
2.9
1.4
1.55
84
170
250
1.65
1.8
116
256
360
Supply Voltage (VDD, VDD_P) .........................................................................6.5V
Digital Inputs .................................................................................. -0.3 to VDD+0.5V
Analog Inputs.................................................................................. -0.3 to VDD+0.5V
Digital Outputs ................................................................................ -0.3 to VDD+0.5V
Analog Outputs ............................................................................... -0.3 to VDD+0.5V
Operating Junction Temperature
Plastic (DB, PW Packages) .......................................................................... 150°C
Storage Temperature Range ..............................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds) .................................................... 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with
respect to Ground. Currents are positive into, negative out of the specified
terminal.
PW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
100°C/W
Junction Temperature Calculation: T
= T
+ (P
x
θ
).
The
θ
numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow.
(Note 1)
PW PACKAGE
(Top View)
!
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