參數(shù)資料
型號(hào): LV49152V-TLM-E
廠商: ON Semiconductor
文件頁(yè)數(shù): 10/11頁(yè)
文件大小: 0K
描述: IC AMP AUDIO CLASS D BTL 44SSOP
標(biāo)準(zhǔn)包裝: 2,000
類型: D 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 15W x 2 @ 8 歐姆
電源電壓: 9 V ~ 18 V
特點(diǎn): 靜音,短路和熱保護(hù),待機(jī)
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 44-SSOPJ
封裝/外殼: 44-LSSOP(0.220",5.60mm 寬)裸露焊盤
包裝: 帶卷 (TR)
FMS6141
Low-Cost,
Single-Channel
4
th
-Order
Standard
Definition
Video
Filter
Driver
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FMS6141 Rev. 1.0.3
8
Layout Considerations
General layout and supply bypassing play a major role
in
high-frequency
performance
and
thermal
characteristics. Fairchild offers a demonstration board
for the FMS6141 to guide layout and aid device
evaluation. The demo board is a four-layer board with
full power and ground planes. Following this layout
configuration provides
optimum performance and
thermal characteristics for the device. For the best
results, follow the steps and recommended routing rules
listed below.
Recommended Routing/Layout Rules
Do not run analog and digital signals in parallel.
Use separate analog and digital power planes to
supply power.
Traces should run on top of the ground plane at all
times.
No trace should run over ground/power splits.
Avoid routing at 90-degree angles.
Minimize clock and video data trace length
differences.
Include 10 F and 0.1 F ceramic power supply
bypass capacitors.
Place the 0.1 F capacitor within 0.1 inches of the
device power pin.
Place the 10 F capacitor within 0.75 inches of the
device power pin.
For multilayer boards, use a large ground plane to
help dissipate heat.
For two-layer boards, use a ground plane that extends
beyond the device body by at least 0.5 inches on all
sides. Include a metal paddle under the device on the
top layer.
Minimize all trace lengths to reduce series inductance.
Thermal Considerations
Since the interior of most systems, such as set-top
boxes, TVs, and DVD players are at +70C;
consideration must be given to providing an adequate
heat sink for the device package for maximum heat
dissipation. When designing a system board, determine
how much power each device dissipates. Ensure that
devices of high power are not placed in the same
location, such as directly above (top plane) and below
(bottom plane) each other on the PCB.
PCB Thermal Layout Considerations
Understand the system power requirements and
environmental conditions.
Maximize thermal performance of the PCB.
Consider using 70 m of copper for high-power
designs.
Make the PCB as thin as possible by reducing FR4
thickness.
Use vias in power pad to tie adjacent layers together.
Remember that baseline temperature is a function of
board area, not copper thickness.
Modeling techniques can provide a first-order
approximation.
Power Dissipation
Consider the FMS6141’s output drive configuration
when calculating overall power dissipation. Care must
be taken not to exceed the maximum die junction
temperature. The following example can be used to
calculate the FMS6141’s power dissipation and internal
temperature rise.
TJ = TA + PCHANNEL
ΘJA
where PCHANNEL = VCC ICH + (VO
2/R
L)
VO = 2VIN + 0.280V
ICH = ICC + (VO/RL)
VIN = RMS value of input signal
ICC = 7mA
VS = 5V
RL = channel load resistance
The FMS6141 is specified to operate with output
currents typically less than 50 mA, which is more than
sufficient for a dual (75 ) video load. The internal
amplifiers of the FMS6141 are current limited to a
maximum of 100 mA and can withstand a brief-duration
short-circuit condition, but this capability is not guaranteed.
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